Datasheet > CM322522_MDS

CM322522_MDS

更新时间： 2024-09-30 12:55:47

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
2页	101K
描述
CM322522 Series Wirewound Chip Inductor

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数据手册

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CM322522_MDS 数据手册

MATERIAL DECLARATION SHEET

Material

Product Line

Date

CM322522 Series

330K

Wirewound Chip Inductor

19-July-2004

Material

Weight

(g)

Construction

No.

CAS

If applicable

Average

Mass (%)

Sum

(%)

Material Group

Ferrite

Material

Remark

Element

Copper (II) Oxide

Zinc Oxide

1317-38-0

1314-13-2

1313-99-1

1308-06-1

1333-86-4

7440-31-5

5.6

18.89

13.3

0.01

62.2

Core

0.005

0.001

Nickel Oxide

Cobalt tetraoxide

Ferric Oxide

Tin

11.9

RoHS exempted: High-melting

point solder

Solder

Internal Connection

Lead

7439-92-1

97.3

2.4

Silver

Phosphor Bronze

Tin

Copper

Polyurethane Resin

7440-22-4

7440-50-8

7440-31-5

7440-58-8

7440-50-8

9009-54-5

1.7

100

99.3

0.7

Pad

Solder Plate

Terminal Electrode

Terminal Solder

0.010

0.001

23.8

2.4

Wire

Coated Wire

Epoxy

0.004

0.001

9.5

2.4

Adhesive

Epoxy

25068-38-6

100

Epoxy Resin

Phenol Novolac

Antimony Trichloride

Brominated epoxy

Fused Silica

29690-82-2

9003-35-4

1309-64-4

40039-93-8

60676-86-0

Coating

Resin

0.020

0.042

47.6

Total Weight

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