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CM1205-08CP PDF预览

CM1205-08CP

更新时间: 2024-01-14 03:40:09
品牌 Logo 应用领域
CALMIRCO 局域网二极管
页数 文件大小 规格书
7页 159K
描述
Trans Voltage Suppressor Diode, 5.5V V(RWM), Unidirectional, 8 Element, Silicon, 3.10 X 1.15 MM, 0.68 MM HEIGHT, ROHS COMPLIANT, CSP-10

CM1205-08CP 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:CSP包装说明:R-PBGA-B10
针数:10Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:2 weeks风险等级:1.39
Is Samacsys:N最大钳位电压:12 V
配置:COMMON ANODE, 8 ELEMENTS二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PBGA-B10
JESD-609代码:e1元件数量:8
端子数量:10封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
认证状态:Not Qualified最大重复峰值反向电压:6 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:TIN SILVER COPPER
端子形式:BALL端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

CM1205-08CP 数据手册

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CM1205  
ESD Protection Arrays, Chip Scale Package  
Product Description  
Features  
Functionally and pin compatible with CAMD’s  
PACDN1404C, PACDN1408C and PACDN1416C  
family of ESD protection devices  
4, 8, or 16 transient voltage suppressors in a single  
package  
OptiguardTM coated for improved reliability at  
assembly  
In-system Electrostatic Discharge (ESD) protection  
to +25kV contact discharge per IEC 61000-4-2  
international standard  
Compact Chip Scale Package (0.65mm pitch) for-  
mat saves board space and eases layout in space  
critical applications compared to discrete solutions  
and traditional wire bonded packages  
Lead-free versions available  
The CM1205 family of transient voltage suppressor  
arrays provides a very high level of protection for sensi-  
tive electronic components that may be subjected to  
ESD.  
These devices are designed and characterized to  
safely dissipate ESD strikes at levels well beyond the  
maximum requirements set forth in the IEC 61000-4-2  
international standard (Level 4, +8kV contact dis-  
charge). All I/Os are rated at +25kV using the IEC  
61000-4-2 contact discharge method. Using the MIL-  
STD-883D (Method 3015) specification for Human  
Body Model (HBM) ESD, all pins are protected for con-  
tact discharges to greater than +30kV.  
The Chip Scale Package format of these devices  
enable extremely small footprints that are necessary in  
portable electronics such as cellular phones, PDAs,  
internet appliances and PCs. The large solder bumps  
allow for standard attachment to laminate boards with-  
out the use of underfill.  
Applications  
ESD protection for sensitive electronic equipment  
I/O port, keypad and button circuitry protection for  
portable devices  
The CM1205 features OptiGuardTM coating for  
improved reliability at assembly and is available with  
optional lead-free finishing.  
Wireless Handsets  
Handheld PCs / PDAs  
MP3 Players  
Digital Cameras and Camcorders  
Notebooks  
Desktop PCs  
Electrical Schematic  
B1 B2 B3  
B4 B5  
B1 B2  
B3  
D1 D2 D3  
D4 D5  
A1 A2 A3  
A4 A5  
A1 A2  
A3  
C1 C2 C3  
B1 B2 B3  
C4 C5  
B4 B5  
CM1205-04CS/CP  
CM1205-08CS/CP  
A1 A2 A3  
A4 A5  
CM1205-16CS/CP  
© 2003 California Micro Devices Corp. All rights reserved.  
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
L
Tel: 408.263.3214  
L
Fax: 408.263.7846  
L
www.calmicro.com  
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