Datasheet > CL10A106MP8NNNC

CL10A106MP8NNNC

更新时间： 2024-01-24 08:08:38

品牌	Logo	应用领域
三星 - SAMSUNG		/
页数	文件大小	规格书
2页	148K
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SPECIFICATION

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CL10A106MP8NNNC 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	0603
包装说明：	CHIP	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8532.24.00.20
风险等级：	1.29	电容：	10 µF
电容器类型：	CERAMIC CAPACITOR	介电材料：	CERAMIC
高度：	0.9 mm	JESD-609代码：	e3
长度：	1.6 mm	安装特点：	SURFACE MOUNT
多层：	Yes	负容差：	20%
端子数量：	2	最高工作温度：	85 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
封装形式：	SMT	包装方法：	TR, CARDBOARD PAPER, 7 INCH
正容差：	20%	额定（直流）电压（URdc）：	10 V
尺寸代码：	0603	表面贴装：	YES
温度特性代码：	X5R	温度系数：	15% ppm/ °C
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier	端子形状：	WRAPAROUND
宽度：	0.8 mm	Base Number Matches：	1

CL10A106MP8NNNC 数据手册

SPECIFICATION

 Samsung P/N : CL10A106MP8NNNC

CAP, 10㎌, 10V, ±20%, X5R, 0603

 Supplier : Samsung electro-mechanics

 Product : Multi-layer Ceramic Capacitor

 Description :

A. Samsung Part Number

CL 10

106

①

②

③

④

⑤

⑥

⑦

⑧

⑨

⑩

⑪

① Series

② Size

Samsung Multi-layer Ceramic Capacitor

0.8

± 0.1 mm

0603 (inch code)

L: 1.6 ± 0.1

③ Dielectric

X5R

⑧ Inner electrode

Termination

Plating

④ Capacitance

⑤ Capacitance

tolerance

㎌

Sn 100%

Normal

±20 %

(Pb Free)

⑨ Product

⑩ Special

⑥ Rated Voltage

⑦ Thickness

10 V

Reserved for future use

Cardboard Type, 7" reel

0.8 ± 0.1 mm

⑪ Packaging

B. Samsung Reliablility Test and Judgement condition

Performance

Test condition

Capacitance

Tan δ (DF)

Within specified tolerance

0.1 max.

0.5±0.1Vrms

1㎑±10%

Insulation

Rated Voltage

60~120 sec.

10,000Mohm or 100Mohm㎌

Whichever is Smaller

No abnormal exterior appearance

No dielectric breakdown or

mechanical breakdown

X5R

Resistance

Appearance

Withstanding

Voltage

Microscope (10)

250%

of the rated voltage

Temperature

Characterisitcs

Adhesive Strength

of Termination

Bending Strength

(From -55℃ to 85℃, Capacitance change shoud be within ±15%)

No peeling shall be occur on the

terminal electrode

500gF, for 10±1 sec.

Capacitance change : within ±12.5% Bending to the limit (1mm)

with 1.0mm/sec.

Solderability

More than 75% of terminal surface

is to be soldered newly

SnAg3.0Cu0.5 solder

245±5℃, 3±0.3sec.

(preheating : 80~120℃ for 10~30sec.)

Resistance to

Soldering heat

Capacitance change : within ±7.5%

Solder pot : 270±5℃, 10±1sec.

Tan δ, IR : initial spec.

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