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CHP

更新时间: 2024-09-24 06:47:43
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描述
Metal Glaze™ Cylindrical Surface Mount Power Resistors

CHP 数据手册

 浏览型号CHP的Datasheet PDF文件第2页浏览型号CHP的Datasheet PDF文件第3页 
Metal Glaze™ Cylindrical  
Surface Mount  
Power Resistors  
Metal Glaze thick  
film element fired  
at 1000°C to solid  
ceramic substrate  
CHP Series  
Up to 2 watts  
Up to 1000 volts  
0.2 ohm to 2.2 megohm range  
RoHS-compliant version available  
150°C maximum operating temperature  
High  
temperature  
dielectric  
coating  
Solder over nickel  
barrier  
Electrical Data  
Indus-  
IRC  
Type  
try  
Foot-  
print  
Size  
Code1  
Maximum  
Power Rating Voltage²  
Working Maximum  
Resistance  
Range (ohms)³  
Product  
Category  
Tolerance  
(±±)³  
TCR  
(ppm/°C)³  
Voltage  
0.1 to 0.99  
1.0 to 1.0 M  
20 to 348K  
0.1 to 0.99  
1.0 to 348K  
0.1 to 0.99  
1.0 to 2.21M  
20 to 348K  
0.2 to 0.99  
1.0 to 2.21M  
Low Range  
Standard  
1, 2, 5  
1, 2, 5  
100  
50, 100  
50, 100  
100  
CHP 1/8  
CHP 1/2  
CHP 1  
1206  
2010  
2512  
3610  
B & C  
D & E  
F
1/4W @ 70°C  
1/2W @ 70°C  
1W @ 70°C  
200  
300  
350  
500  
400  
600  
Tight Tolerance  
Low Range  
Standard  
0.25, 0.5  
1, 2, 5  
1, 2, 5  
50, 100  
100  
Low Range  
Standard  
1, 2, 5  
700  
1, 2, 5  
50, 100  
50, 100  
100  
Tight Tolerance  
Low Range  
Standard  
0.25, 0.5  
1, 2, 5  
2W @ 25°C  
1.33W @ 70°C  
CHP 2  
H
1000  
1, 2, 5  
50, 100  
¹See page 8 for product dimensions, recommended solder pads, and standard packaging.  
²Not to exceed P x R  
³Consult factory for tighter TCR, tolerance, or resistance values.  
Environmental Data  
Characteristics  
Temperature Coefficient  
Thermal Shock  
Maximum Change  
Test Method  
As specified  
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)  
0.5ꢀ + 0.01 ohm  
0.25ꢀ + 0.01 ohm  
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)  
Low Temperature Operation  
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)  
MIL-R-55342E Par 4.7.5  
0.5ꢀ + 0.01 ohm  
1ꢀ for R>100K ohm  
Short Time Overload  
2.5 x  
for 5 seconds  
High Temperature Exposure  
Resistance to Bonding  
Exposure  
0.5ꢀ + 0.01 ohm  
0.25ꢀ + 0.01 ohm  
95ꢀ minimum coverage  
0.5ꢀ + 0.01 ohm  
MIL-R-55342E Par 4.7.6 (-150°C for 100 hours)  
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)  
MIL-STD-202, Method 208 (245°C for 5 seconds)  
Solderability  
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)  
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)  
Moisture Resistance  
0.5ꢀ + 0.01 ohm  
Life Test  
Terminal Adhesion Strength  
1ꢀ + 0.01 ohm  
no mechanical damage  
1200 gram push from underside of mounted cchip for 60 seconds  
1ꢀ + 0.01 ohm  
no mechanical damage  
Chip mounted in center of 90mm long board, deflected 1mm so as to  
exert pull on chip contacts for 5 seconds  
General Note  
IRC reserves the right to make changes in product specification without notice or liability.  
All information is subject to IRC’s own data and is considered accurate at time of going to print.  
A subsidiary of  
TT electronics plc  
© IRC Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com  
CHP Series Issue July 2009 Sheet 1 of 3  

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