Metal Glaze™ Cylindrical
Surface Mount
Power Resistors
™
Metal Glaze thick
film element fired
at 1000°C to solid
ceramic substrate
CHP Series
• Up to 2 watts
• Up to 1000 volts
• 0.2 ohm to 2.2 megohm range
• RoHS-compliant version available
• 150°C maximum operating temperature
High
temperature
dielectric
coating
Solder over nickel
barrier
Electrical Data
Indus-
IRC
Type
try
Foot-
print
Size
Code1
Maximum
Power Rating Voltage²
Working Maximum
Resistance
Range (ohms)³
Product
Category
Tolerance
(±±)³
TCR
(ppm/°C)³
Voltage
0.1 to 0.99
1.0 to 1.0 M
20 to 348K
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
1.0 to 2.21M
20 to 348K
0.2 to 0.99
1.0 to 2.21M
Low Range
Standard
1, 2, 5
1, 2, 5
100
50, 100
50, 100
100
CHP 1/8
CHP 1/2
CHP 1
1206
2010
2512
3610
B & C
D & E
F
1/4W @ 70°C
1/2W @ 70°C
1W @ 70°C
200
300
350
500
400
600
Tight Tolerance
Low Range
Standard
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
100
Low Range
Standard
1, 2, 5
700
1, 2, 5
50, 100
50, 100
100
Tight Tolerance
Low Range
Standard
0.25, 0.5
1, 2, 5
2W @ 25°C
1.33W @ 70°C
CHP 2
H
1000
1, 2, 5
50, 100
¹See page 8 for product dimensions, recommended solder pads, and standard packaging.
²Not to exceed P x R
³Consult factory for tighter TCR, tolerance, or resistance values.
√
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Maximum Change
Test Method
As specified
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
0.5ꢀ + 0.01 ohm
0.25ꢀ + 0.01 ohm
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
0.5ꢀ + 0.01 ohm
1ꢀ for R>100K ohm
Short Time Overload
2.5 x
for 5 seconds
√
High Temperature Exposure
Resistance to Bonding
Exposure
0.5ꢀ + 0.01 ohm
0.25ꢀ + 0.01 ohm
95ꢀ minimum coverage
0.5ꢀ + 0.01 ohm
MIL-R-55342E Par 4.7.6 (-150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
Solderability
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
Moisture Resistance
0.5ꢀ + 0.01 ohm
Life Test
Terminal Adhesion Strength
1ꢀ + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted cchip for 60 seconds
1ꢀ + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected 1mm so as to
exert pull on chip contacts for 5 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© IRC Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CHP Series Issue July 2009 Sheet 1 of 3