Datasheet > CGA4F2C0G1H153J085AE

CGA4F2C0G1H153J085AE

更新时间： 2024-10-02 01:26:15

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	168K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : November 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA4F2C0G1H153J085AE

TDK item description CGA4F2C0G1H153JT***S

Applications

Feature

Automotive Grade

Soft Soft Termination

AEC-Q200 AEC-Q200

CGA4(2012) [EIA 0805]

Production

Series

Status

Size

2.00mm +0.45,-0.20mm

Length(L)

Width(W)

1.25mm +0.25,-0.20mm

0.85mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

15nF ±5%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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