Datasheet > CG0402MLU-3.3-E

CG0402MLU-3.3-E

更新时间： 2022-02-26 10:26:17

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
3页	160K
描述
ESD Protectors

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CG0402MLU-3.3-E 数据手册

ChipGuard^®MLU Series - ESD Protectors

Product Dimensions

Recommended Pad Layout

(INCHES)

DIMENSIONS:

CG0402

Series

CG0603

Series

CG0402

Series

CG0603

Series

Dimension

Dim.

1.00 0.1ꢀ

1.60 0.ꢁ0

0.ꢀ1

0.76

(0.04 0.006ꢂ

(0.064 0.00ꢃꢂ

(0.0ꢁ0ꢂ

(0.030ꢂ

0.ꢀ0 0.10

0.ꢃ0 0.ꢁ0

0.61

1.0ꢁ

(0.0ꢁ 0.004ꢂ

(0.03ꢁ 0.00ꢃꢂ

(0.0ꢁ4ꢂ

(0.040ꢂ

0.36 0.0ꢀ

0.4ꢀ 0.10

0.ꢀ1

0.ꢀ0

(0.014 0.00ꢁꢂ

(0.01ꢃ 0.004ꢂ

(0.0ꢁ0ꢂ

0.ꢁꢀ 0.1ꢀ

0.30 0.ꢁ0

1.70

ꢁ.ꢀ4

(0.10 0.006ꢂ

(0.01ꢁ 0.00ꢃꢂ

(0.067ꢂ

(0.100ꢂ

Solder Reﬂow Recommendations

Preheat Stages 1-3

Soldering

Cooling

300

250

200

150

100

Stage 1 Preheat

Ambient to Preheating

Temperature

30 s to 60 s

Stage ꢁ Preheat

Stage 3 Preheat

Main Heating

140 °C to 160 °C

Preheat to ꢁ00 °C

ꢁ00 °C

ꢁ10 °C

ꢁꢁ0 °C

ꢁ30 °C

ꢁ40 °C

60 s to 1ꢁ0 s

ꢁ0 s to 40 s

60 s to 70 s

ꢀꢀ s to 6ꢀ s

ꢀ0 s to 60 s

40 s to ꢀ0 s

30 s to 40 s

Cooling

ꢁ00 °C to 100 °C

1 °C/s to 4 °C/s

110 sec. (min.)

120 sec. (min.)

30-70

sec.

Time (seconds)

•

This product can be damaged by rapid heating, cooling or localized heating.

Heat shocks should be avoided. Preheating and gradual cooling recommended.

Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.

Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.

A solder gun under 30 watts is recommended.

Speciﬁcations are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their speciﬁc applications.

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