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CFKJ0E14R35LSBP

更新时间： 2024-01-01 16:47:26
品牌 Logo 应用领域
埃梯梯 - ITT 连接器
页数 文件大小 规格书
6页 1131K
描述
MIL Series Connector, 37 Contact(s), Female, Solder Terminal, Receptacle,

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CFKJ0E14R35LSBP 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：compliant风险等级：5.7
其他特性：STANDARD: MIL-DTL-38999, POLARIZED后壳类型：SOLID
主体/外壳类型：RECEPTACLE连接器类型：MIL SERIES CONNECTOR
触点性别：FEMALE耦合类型：THREADED
DIN 符合性：NO空壳：NO
环境特性：CORROSION RESISTANT滤波功能：YES
IEC 符合性：NOMIL 符合性：YES
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装类型：BOARD AND PANEL选件：GENERAL PURPOSE
外壳面层：ZINC ALLOY PLATED外壳尺寸：14
端接类型：SOLDER触点总数：37
Base Number Matches：1

CFKJ0E14R35LSBP 数据手册

 浏览型号CFKJ0E14R35LSBP的Datasheet PDF文件第1页浏览型号CFKJ0E14R35LSBP的Datasheet PDF文件第3页浏览型号CFKJ0E14R35LSBP的Datasheet PDF文件第4页浏览型号CFKJ0E14R35LSBP的Datasheet PDF文件第5页浏览型号CFKJ0E14R35LSBP的Datasheet PDF文件第6页 
Rugged Design plus up to  
15% Savings in Weight  
Technology Update  
With the increasing demand for lighter weight and more  
rugged filter connectors, ITT Electronic Components, has  
advanced the state of the art in filter technology with the  
new Cannon Chip-on-Flex (CoF) design.  
Cannon’s new Chip-on-Flex filter connector has the additional  
benefit of being the lightest weight design. The 38999-Style  
Series III CoF offers up to a 15% savings in weight over the  
ceramic planar array equivalent.  
Cannon’s Chip-on-Flex filter connector technology  
provides a significant performance improvement in  
thermal shock and vibration to the ceramic planar array  
technology that is the current industry standard. The  
current planar array design utilizes a ceramic block  
capacitor with plated thru holes where feed thru contacts  
are inserted and soldered into place. Internal stresses  
associated with vibration, thermal expansion/contraction  
The new Chip-on-Flex connector  
will protect critical circuits from  
electrical interference providing  
a “stray signal barrier”  
upstream and away from  
electronic devices without  
Flex  
Circuit  
affecting system function and  
performance.  
Chip Capacitor  
can build at the solder joints and  
Solder Joint  
cause the ceramic material to crack  
resulting in a filter failure. As a  
consequence, costly thermal shock  
screening and burn in procedures  
are often used for quality  
ARINC 404 Type  
New Chip-on-Flex Design  
The Chip-on-Flex filter  
connector provides all the  
same benefits of filter  
connector technologies.  
assurance.  
1. Individual isolated pin filtering of high frequency  
noise, shunted to ground via the connector shell.  
The cut-in frequency of the filtering is selected by  
the user from the performance attenuation curves.  
Ceramic  
Array  
In the new Cannon Chip-on-Flex  
design, the internal thermal shock  
stresses have been virtually  
eliminated. The fragile  
38999-Style  
Current Planar Array Design  
2. Built-in ground plane barrier in the connector insert.  
This eliminates EMI windows on the face of systems  
where connectors enter or exit boxes.  
ceramic planar array  
capacitor block has been  
replaced by a flex circuit where individual chip capacitors  
are surface mounted on a pad adjacent to the feed thru  
contact.  
3. Filtering at the face of system boxes eliminating  
filtering on the PCB, freeing up board space, and  
maintaining EMI integrity of the system by not  
allowing unwanted signals to enter the box.  
The result is a very robust filter connector with superior  
mechanical performance and improved reliability.  
Applications  
New Design/Development Flexibility and  
Reduced Leadtimes  
The CoF filter connectors are ideal for high reliability military,  
aerospace and industrial applications:  
Cannon’s Chip-on-Flex filter design offers the system  
designer new and complete flexibility in defining or  
changing individual circuit requirements without the need  
to retool the ceramic planar array. The Chip-on-Flex  
design utilizes readily available flex circuits and devices  
leading to reduced design / development cycle time and  
overall production delivery.  
•
•
•
•
•
•
•
•
•
Integrated Avionics Systems  
Communication and Navigation  
Displays and Instrumentation  
Data Processing Equipment  
Electronic Warfare Systems  
Radar and Sensors  
Weapons Controls and Targeting Systems  
Electronic Counter Measures  
Satellites and Space Systems  
1. Virtually no limitations on the variation in  
capacitance/feed-thru/ground/diode choices that is  
readily available to the customer. The exact same  
flex circuit is used. Cannon installs the appropriate  
device in each location as selected by the customer.  
2. EMP protection can be simply added by substituting  
a Zener diode in place of a chip capacitor.  
123456

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