Rugged Design plus up to
15% Savings in Weight
Technology Update
With the increasing demand for lighter weight and more
rugged filter connectors, ITT Electronic Components, has
advanced the state of the art in filter technology with the
new Cannon Chip-on-Flex (CoF) design.
Cannon’s new Chip-on-Flex filter connector has the additional
benefit of being the lightest weight design. The 38999-Style
Series III CoF offers up to a 15% savings in weight over the
ceramic planar array equivalent.
Cannon’s Chip-on-Flex filter connector technology
provides a significant performance improvement in
thermal shock and vibration to the ceramic planar array
technology that is the current industry standard. The
current planar array design utilizes a ceramic block
capacitor with plated thru holes where feed thru contacts
are inserted and soldered into place. Internal stresses
associated with vibration, thermal expansion/contraction
The new Chip-on-Flex connector
will protect critical circuits from
electrical interference providing
a “stray signal barrier”
upstream and away from
electronic devices without
Flex
Circuit
affecting system function and
performance.
Chip Capacitor
can build at the solder joints and
Solder Joint
cause the ceramic material to crack
resulting in a filter failure. As a
consequence, costly thermal shock
screening and burn in procedures
are often used for quality
ARINC 404 Type
New Chip-on-Flex Design
The Chip-on-Flex filter
connector provides all the
same benefits of filter
connector technologies.
assurance.
1. Individual isolated pin filtering of high frequency
noise, shunted to ground via the connector shell.
The cut-in frequency of the filtering is selected by
the user from the performance attenuation curves.
Ceramic
Array
In the new Cannon Chip-on-Flex
design, the internal thermal shock
stresses have been virtually
eliminated. The fragile
38999-Style
Current Planar Array Design
2. Built-in ground plane barrier in the connector insert.
This eliminates EMI windows on the face of systems
where connectors enter or exit boxes.
ceramic planar array
capacitor block has been
replaced by a flex circuit where individual chip capacitors
are surface mounted on a pad adjacent to the feed thru
contact.
3. Filtering at the face of system boxes eliminating
filtering on the PCB, freeing up board space, and
maintaining EMI integrity of the system by not
allowing unwanted signals to enter the box.
The result is a very robust filter connector with superior
mechanical performance and improved reliability.
Applications
New Design/Development Flexibility and
Reduced Leadtimes
The CoF filter connectors are ideal for high reliability military,
aerospace and industrial applications:
Cannon’s Chip-on-Flex filter design offers the system
designer new and complete flexibility in defining or
changing individual circuit requirements without the need
to retool the ceramic planar array. The Chip-on-Flex
design utilizes readily available flex circuits and devices
leading to reduced design / development cycle time and
overall production delivery.
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Integrated Avionics Systems
Communication and Navigation
Displays and Instrumentation
Data Processing Equipment
Electronic Warfare Systems
Radar and Sensors
Weapons Controls and Targeting Systems
Electronic Counter Measures
Satellites and Space Systems
1. Virtually no limitations on the variation in
capacitance/feed-thru/ground/diode choices that is
readily available to the customer. The exact same
flex circuit is used. Cannon installs the appropriate
device in each location as selected by the customer.
2. EMP protection can be simply added by substituting
a Zener diode in place of a chip capacitor.