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CD4541BE PDF预览

CD4541BE

更新时间: 2024-02-09 23:56:08
品牌 Logo 应用领域
德州仪器 - TI 计数器光电二极管高压
页数 文件大小 规格书
9页 95K
描述
CMOS PROGRAMMABLE TIMER HIGH VOLTAGE TYPES(20V RATING)

CD4541BE 技术参数

生命周期:Obsolete零件包装代码:TSSOP
包装说明:TSSOP, TSSOP14,.25针数:14
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.24计数方向:UP
系列:4000/14000/40000JESD-30 代码:R-PDSO-G14
长度:5 mm负载/预设输入:YES
逻辑集成电路类型:BINARY COUNTER工作模式:SYNCHRONOUS
位数:16功能数量:1
端子数量:14最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP14,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd):10.5 ns认证状态:Not Qualified
座面最大高度:1.2 mm标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
触发器类型:POSITIVE EDGE宽度:4.4 mm

CD4541BE 数据手册

 浏览型号CD4541BE的Datasheet PDF文件第3页浏览型号CD4541BE的Datasheet PDF文件第4页浏览型号CD4541BE的Datasheet PDF文件第5页浏览型号CD4541BE的Datasheet PDF文件第6页浏览型号CD4541BE的Datasheet PDF文件第8页浏览型号CD4541BE的Datasheet PDF文件第9页 
CD4541B  
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)  
c1 LEAD FINISH  
F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A)  
14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE  
-D-  
E
-A-  
INCHES MILLIMETERS  
MIN  
BASE  
(c)  
METAL  
SYMBOL  
MAX  
0.200  
0.026  
0.023  
0.065  
0.045  
0.018  
0.015  
0.785  
0.310  
MIN  
-
MAX  
5.08  
0.66  
0.58  
1.65  
1.14  
0.46  
0.38  
19.94  
7.87  
NOTES  
b1  
A
b
-
-
M
M
(b)  
0.014  
0.014  
0.045  
0.023  
0.008  
0.008  
-
0.36  
0.36  
1.14  
0.58  
0.20  
0.20  
-
2
-B-  
b1  
b2  
b3  
c
3
SECTION A-A  
bbb  
C A - B  
D
D
S
S
S
-
4
BASE  
PLANE  
Q
2
A
-C-  
SEATING  
PLANE  
c1  
D
3
L
α
5
S1  
b2  
eA  
A A  
e
E
0.220  
5.59  
5
b
C A - B  
eA/2  
aaa M C A - B S D S  
c
e
0.100 BSC  
2.54 BSC  
-
eA  
eA/2  
L
0.300 BSC  
0.150 BSC  
7.62 BSC  
3.81 BSC  
-
ccc  
D
S
M
S
-
NOTES:  
0.125  
0.200  
0.060  
-
3.18  
5.08  
1.52  
-
-
1. Index area: A notch or a pin one identification mark shall be locat-  
ed adjacent to pin one and shall be located within the shaded  
area shown. The manufacturer’s identification shall not be used  
as a pin one identification mark.  
Q
0.015  
0.005  
0.38  
0.13  
6
S1  
7
o
o
o
o
90  
105  
90  
105  
-
α
2. The maximum limits of lead dimensions b and c or M shall be  
measured at the centroid of the finished lead surfaces, when  
solder dip or tin plate lead finish is applied.  
aaa  
bbb  
ccc  
M
-
-
-
-
0.015  
0.030  
0.010  
0.0015  
-
-
-
-
0.38  
0.76  
0.25  
0.038  
-
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension  
M applies to lead plating and finish thickness.  
-
2, 3  
8
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a  
partial lead paddle. For this configuration dimension b3 replaces  
dimension b2.  
N
14  
14  
Rev. 0 4/94  
5. This dimension allows for off-center lid, meniscus, and glass  
overrun.  
6. Dimension Q shall be measured from the seating plane to the  
base plane.  
7. Measure dimension S1 at all four corners.  
8. N is the maximum number of terminal positions.  
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.  
10. Controlling dimension: INCH.  
7

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