Datasheet > CD-02-05-DO5

CD-02-05-DO5

更新时间： 2024-09-29 22:58:15

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
3页	346K
描述
THERM PAD DO-5 1.00"OD/0.250"ID

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CD-02-05-DO5 数据手册

ulTIMiFlux Dielectric Phase Change Thermal Material

CD-02-05

60^oC/140^oF PHASE-CHANGE TEMPERATURE

FEATURES AND BENIFITS

● Low Thermal Impedance

● Excellent Replacement for Thermal Greases

● Thixotropic / Prevents Compound Run-Out

● Excellent Mechanical & Dielectric Properties

● Cost Effective “Drop in Place” Solution

● RoHS and Halogen Free Compliant

Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost,

configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are

a secondary material installed between the heat sink and the device which are designed to improve the

thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there

will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a

TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case

usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids

between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier

in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.

Through the development of this unique formulation,

Wakefield-Vette’s phase change solution offers

efficient thermal transfer by phase-changing during

normal device operating temperatures while

maintaining a uniform bond line thus driving out the

air and adjusting for any surface imperfections or

flatness conditions that may exist across the interface.

This construction is useful in a wide range of

electronic cooling applications from transistors,

diodes or any type of heat generating non-isolated

power device.

Standard Phase Change Pad Construction

Phase Change Compound

Polyimide Substrate Carrier

Phase Change Compound

A primary advantage of utilizing a phase-

change system is the ability to drive out air

from within the interface during initial device

cycling causing phase change and surface

wetting of the thermal compound coating.

The phase-change compound is available in

specific die cut patterns for common TO

packages and can be placed instantly and

immediately ready for component mounting.

Due to it’s thixotropic formulation design,

compound is held within the interface with no

worries of run-out into unwanted areas during

normal device/component operation.

www.wakefield-vette.com

12 3

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