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CC2540F128 PDF预览

CC2540F128

更新时间: 2024-02-09 17:48:12
品牌 Logo 应用领域
德州仪器 - TI 蓝牙
页数 文件大小 规格书
33页 770K
描述
2.4-GHz Bluetooth? low energy System-on-Chip

CC2540F128 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:VQFN-40针数:40
Reach Compliance Code:compliantHTS代码:8542.31.00.01
Factory Lead Time:1 week风险等级:2.14
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/5731.2.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=5731
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=57313D View:https://componentsearchengine.com/viewer/3D.php?partID=5731
Samacsys PartID:5731Samacsys Image:https://componentsearchengine.com/Images/9/CC2540F128RHAT.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/2/CC2540F128RHAT.jpgSamacsys Pin Count:41
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Quad Flat No-Lead
Samacsys Footprint Name:RHA (S-PVQFN-N40)_1Samacsys Released Date:2015-04-16 09:48:08
Is Samacsys:N总线兼容性:SPI; USART; USB
JESD-30 代码:S-PQCC-N40JESD-609代码:e4
长度:6 mm湿度敏感等级:3
端子数量:40最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装等效代码:LCC40,.24SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3 V
认证状态:Not QualifiedRAM(字节):8192
RAM(字数):8座面最大高度:1 mm
子类别:Other uPs/uCs/Peripheral ICs最大供电电压:3.6 V
最小供电电压:2 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

CC2540F128 数据手册

 浏览型号CC2540F128的Datasheet PDF文件第1页浏览型号CC2540F128的Datasheet PDF文件第2页浏览型号CC2540F128的Datasheet PDF文件第3页浏览型号CC2540F128的Datasheet PDF文件第5页浏览型号CC2540F128的Datasheet PDF文件第6页浏览型号CC2540F128的Datasheet PDF文件第7页 
CC2540F128, CC2540F256  
SWRS084 OCTOBER 2010  
www.ti.com  
UNIT  
GENERAL CHARACTERISTICS  
Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
WAKE-UP AND TIMING  
Digital regulator on, 16-MHz RCOSC and 32-MHz crystal  
oscillator off. Start-up of 16-MHz RCOSC  
Power mode 1 Active  
4
120  
410  
ms  
ms  
ms  
Digital regulator off, 16-MHz RCOSC and 32-MHz crystal  
oscillator off. Start-up of regulator and 16-MHz RCOSC  
Power mode 2 or 3 Active  
Crystal ESR = 16 . Initially running on 16-MHz RCOSC,  
with 32-MHz XOSC OFF  
Active TX or RX  
With 32-MHz XOSC initially on  
160  
150  
ms  
ms  
RX/TX turnaround  
RADIO PART  
RF frequency range  
Data rate and modulation format  
Programmable in 2-MHz steps  
2402  
2480  
MHz  
1 Mbps, GFSK, 250 kHz deviation  
RF RECEIVE SECTION  
Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz  
1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER(1)  
PARAMETER  
Receiver sensitivity(2)  
Receiver sensitivity(2)  
Saturation(3)  
Co-channel rejection(3)  
Adjacent-channel rejection(3)  
Alternate-channel rejection(3)  
Blocking(3)  
Frequency error tolerance(4)  
Symbol rate error tolerance(5)  
TEST CONDITIONS  
MIN TYP MAX  
UNIT  
dBm  
dBm  
dBm  
dB  
High-gain mode  
Standard mode  
–93  
–87  
6
–5  
5
±1 MHz  
±2 MHz  
dB  
30  
–30  
dB  
dBm  
kHz  
ppm  
Including both initial tolerance and drift  
–250  
–80  
250  
80  
Conducted measurement with a 50-Ω single-ended load.  
Complies with EN 300 328, EN 300 440 class 2, FCC CFR47,  
Part 15 and ARIB STD-T-66  
Spurious emission. Only largest spurious  
emission stated within each band.  
–75  
dBm  
RX mode, standard mode, no peripherals active, low MCU  
activity, MCU at 250 kHz  
19.6  
22.1  
Current consumption  
mA  
RX mode, high-gain mode, no peripherals active, low MCU  
activity, MCU at 250 kHz  
(1) 0.1% BER maps to 30.8% PER  
(2) The receiver sensitivity setting is programmable using a TI BLE stack vendor-specific API command. The default value is standard  
mode.  
(3) Results based on standard gain mode  
(4) Difference between center frequency of the received RF signal and local oscillator frequency  
(5) Difference between incoming symbol rate and the internally generated symbol rate  
4
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): CC2540F128 CC2540F256  

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