是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | HVQCCN, LCC36,.25SQ,20 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.29 | JESD-30 代码: | S-PQCC-N36 |
JESD-609代码: | e4 | 长度: | 6 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC36,.25SQ,20 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 3 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
子类别: | Other Telecom ICs | 标称供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
电信集成电路类型: | RF AND BASEBAND CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 6 mm |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
CC2511F16RSPR | TI |
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型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CC2511F16RSPR | TI |
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CC2511F16RSPR | TAOS |
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CC2511F16RSPRG3 | TI |
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CC2511F32RSP | TI |
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CC2511F32RSP | TAOS |
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CC2511F32RSPG3 | TI |
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CC2511F32RSPR | TI |
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CC2511F32RSPR | TAOS |
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CC2511F8RSP | TAOS |
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CC2511F8RSP | TI |
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