Datasheet > C3225C0G1H223J125AA_17

C3225C0G1H223J125AA_17

更新时间： 2024-10-02 01:22:59

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	186K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 29, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C3225C0G1H223J125AA

TDK item description C3225C0G1H223JT****

Commercial Grade

Applications

Please refer to Part No. CGA6J2C0G1H223J125AA for Automotive use.

General General (Up to 50V)

C3225 [EIA 1210]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

3.20mm ±0.40mm

Length(L)

Width(W)

2.50mm ±0.30mm

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

2.00mm to 2.40mm

1.00mm to 1.20mm

1.90mm to 2.50mm

Electrical Characteristics

Capacitance

22nF ±5%

50VDC

Rated Voltage

Temperature Characteristic

Q (Min.)

C0G(0±30ppm/°C)

1000

Insulation Resistance (Min.)

10000MΩ

Other

Soldering Method

AEC-Q200

Reﬂow

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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