Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10VDC-200VDC (Commercial Grade)
100% Tin or SnPb Plate
L
Dimensions – Millimeters (Inches)
W
B
T
Nickel Plate
S
Conductive Metalization
Electrodes
EIA
Size
Code
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
Metric
Size
Code
0603
1005
1608
2012
S
L
W
Width
T
B
Mounting
Technique
Separation
Min.
Length
Thickness
Bandwidth
0.60 (.024) ± 0.03 (.001) 0.30 (.012) ± 0.03 (.001)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
0.15 (.006) ± 0.05 (.002)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
N/A
Solder Reflow Only
0.30 (.012)
0.70 (.028)
0.75 (.030)
Solder Wave or
Solder Reflow
3216
3225
4520
4532
4564
5650
5664
N/A
Solder Reflow Only
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
RoHS compliant
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1003_C0G • 8/10/2011
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