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C0201C101J3GAC7867 PDF预览

C0201C101J3GAC7867

更新时间: 2024-02-12 15:16:31
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
9页 1072K
描述
Ceramic Capacitor, Multilayer, Ceramic, 25V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0001uF, Surface Mount, 0201, CHIP

C0201C101J3GAC7867 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 0201
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.24.00.20风险等级:4.9
电容:0.0001 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMICJESD-609代码:e3
安装特点:SURFACE MOUNT多层:Yes
负容差:5%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, PAPER, 7 INCH
正容差:5%额定(直流)电压(URdc):25 V
尺寸代码:0201表面贴装:YES
温度特性代码:C0G温度系数:30ppm/Cel ppm/ °C
端子面层:Tin (Sn)端子形状:WRAPAROUND
Base Number Matches:1

C0201C101J3GAC7867 数据手册

 浏览型号C0201C101J3GAC7867的Datasheet PDF文件第3页浏览型号C0201C101J3GAC7867的Datasheet PDF文件第4页浏览型号C0201C101J3GAC7867的Datasheet PDF文件第5页浏览型号C0201C101J3GAC7867的Datasheet PDF文件第6页浏览型号C0201C101J3GAC7867的Datasheet PDF文件第7页浏览型号C0201C101J3GAC7867的Datasheet PDF文件第9页 
CERAMIC CHIP CAPACITORS  
Packaging Information  
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):  
10 pitches cumulative  
P0  
tolerance on tape  
± 0.2 (± 0.008)  
T
D0  
P2  
E
Top  
Tape  
Cover  
A0  
Bottom  
Tape  
Cover  
F
W
B0  
G2  
T1  
P1  
Center lines  
of cavity  
Max. Cavity Size  
See Note 1  
Table 1  
User Direction of Feed  
Table 1: 8 & 12mm PunchedTape  
(Metric Dimensions Will Govern)  
Constant Dimensions - Millimeters (Inches)  
Tape  
Size  
D
P
P
T
G
G
2
E
R Min.  
0
0
2
1
1
8mm  
and  
12mm  
1.5  
1.75 ± 0.10  
4.0 ± 0.10  
2.0 ± 0.05  
0.10 0.75 0.75 25 (.984)  
(.004) (.030) (.030) See Note 2  
+0.10, -0.0  
(.059  
(.069 ± 0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.  
Table 1  
+0.004, -0.0)  
Table 1: 8 & 12mm PunchedTape  
(Metric Dimensions Will Govern)  
Variable Dimensions - Millimeters (Inches)  
Tape  
Size  
P
W
A B  
0 0  
T
F
1
8mm  
1/2  
2.0 ± 0.10  
1.1mm (.043)  
Max. for Paper  
Base Tape and  
1.6mm (.063)  
Max. for Non-  
Paper Base  
(.079 ± .004)  
3.5 ± 0.05  
8.0 ± ±0.3  
See Note 1  
Table 1  
Pitch See Require-  
ments  
(.138 ± .002)  
(.315 ± ±0.012)  
Section 3.3 (d)  
8mm  
4.0 ± 0.10  
(0.157 ± .004)  
Compositions.  
See Note 3.  
12mm  
12mm  
4.0 ± 0.10  
5.5 ± 0.05  
12.0 ± 0.3  
(0.157 ± .004)  
8.0 ± 0.10  
(.217 ± .002)  
(.472 ± .012)  
Double (0.315 ± .004)  
Pitch  
Note:  
1. A , B and T determined by the maximum dimensions to the ends of the terminals extending from the  
0
0
body and/or the body dimensions of the component. The clearance between the ends of the terminals or  
body of the component to the sides and depth of the cavity (A , B and T) must be within 0.05mm (.002)  
0
0
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component  
within the cavity of not more than 20 degrees (see sketches A and B).  
2. Tape with components shall pass around radius "R" without damage.  
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.  
Sketch C:  
Component Rotation - Top View  
Maximum  
Sketch B:  
R
(Min.)  
Max. Component  
Rotation - Front  
component rotation.  
Sketch A:  
Bending Radius  
See Note 2  
Table 1  
20°  
Cross Sectional View  
Typical  
component  
center line  
20°  
96  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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