®
Accu-P
Environmental ꢀ Mechanical Characteristics
ENVIRONMENTAL CHARACTERISTICS
TEST
CONDITIONS
REQUIREMENT
Life (Endurance)
MIL-STD-202F Method 108A
125ꢀC, 2UR,1000 hours
No visible damage
Δ C/C ≤ 2ꢁ for C≥5pF
Δ C ≤ 0.25pF for C<5pF
Accelerated Damp
Heat Steady State
MIL-STD-202F Method 103B
85ꢀC, 85ꢁ RH, UR, 1000 hours
-55ꢀC to +125ꢀC, 15 cycles – Accu-P®
260ꢀC 5ꢀC for 10 secs
No visible damage
Δ C/C ≤ 2ꢁ for C≥5pF
Δ C ≤ 0.25pF for C<5pF
Temperature Cycling
MIL-STD-202F Method 107E
MIL-STD-883D Method 1010.7
No visible damage
Δ C/C ≤ 2ꢁ for C≥5pF
Δ C ≤ 0.25pF for C<5pF
Resistance to Solder Heat
IEC-68-2-58
C remains within initial limits
MECHANICAL CHARACTERISTICS
TEST
CONDITIONS
REQUIREMENT
Solderability
IEC-68-2-58
Components completely immersed in a
solder bath at 235ꢀC for 2 secs.
Terminations to be well tinned, minimum 95ꢁ
coverage
Leach Resistance
IEC-68-2-58
Components completely immersed in a
solder bath at 260 5ꢀC for 60 secs.
Dissolution of termination faces ≤15ꢁ of area
Dissolution of termination edges ≤25ꢁ of length
Adhesion
A force of 5N applied for 10 secs.
No visible damage
MIL-STD-202F Method 211A
Termination Bond Strength
IEC-68-2-21 Amend. 2
Tested as shown in diagram
No visible damage
Δ C/C ≤ 2ꢁ for C≥5pF
Δ C ≤ 0.25pF for C<5pF
D = 3mm Accu-P
D = 1mm Accu-F
Robustness of Termination
IEC-68-2-21 Amend. 2
A force of 5N applied for 10 secs.
55Hz to 2000Hz, 20G
No visible damage
No visible damage
High Frequency Vibration
MIL-STD-202F Method 201A,
®
204D (Accu-P only)
Storage
12 months minimum with components
stored in “as received” packaging
Good solderability
Average capacitance with histogram printout for
capacitance distribution;
QUALITY & RELIABILITY
Accu-P® is based on well established thin-film technology
and materials.
IR and Breakdown Voltage distribution;
Temperature Coefficient;
Solderability;
• ON-LINE PROCESS CONTROL
Dimensional, mechanical and temperature stability.
This program forms an integral part of the production cycle
and acts as a feedback system to regulate and control
production processes. The test procedures, which are
integrated into the production process, were developed
after long research work and are based on the highly
developed semiconductor industry test procedures and
equipment. These measures help AVX to produce a con-
sistent and high yield line of products.
QUALITY ASSURANCE
The reliability of these thin-film chip capacitors has been
studied intensively for several years. Various measures
have been taken to obtain the high reliability required today
by the industry. Quality assurance policy is based on well
established international industry standards. The reliability
of the capacitors is determined by accelerated testing
under the following conditions:
• FINAL QUALITY INSPECTION
Life (Endurance)
Accelerated Damp
Heat Steady State
125ꢀC, 2UR, 1000 hours
Finished parts are tested for standard electrical parameters
and visual/mechanical characteristics. Each production lot
is 100ꢁ evaluated for: capacitance and proof voltage at
2.5 UR. In addition, production is periodically evaluated for:
85ꢀC, 85ꢁ RH, UR,
1000 hours.
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