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BU2152FS-E1 PDF预览

BU2152FS-E1

更新时间: 2024-01-24 22:48:00
品牌 Logo 应用领域
罗姆 - ROHM 驱动光电二极管接口集成电路
页数 文件大小 规格书
25页 1047K
描述
SIPO Based Peripheral Driver, 0.025A, PDSO32, ROHS COMPLIANT, SSOP-32

BU2152FS-E1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SSOP
包装说明:SSOP,针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.63
接口集成电路类型:SIPO BASED PERIPHERAL DRIVERJESD-30 代码:R-PDSO-G32
JESD-609代码:e2长度:13.6 mm
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-25 °C
输出电流流向:SINK标称输出峰值电流:0.025 A
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.9 mm最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:YES温度等级:OTHER
端子面层:TIN COPPER端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:10宽度:5.4 mm
Base Number Matches:1

BU2152FS-E1 数据手册

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Operation Notes  
1. Absolute maximum ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can  
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any  
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as  
fuses.  
2. Connecting the power supply connector backward  
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply  
lines. An external direction diode can be added.  
3. Power supply lines  
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,  
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to  
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit,  
not that capacitance characteristic values are reduced at low temperatures.  
4. GND voltage  
The potential of GND pin must be minimum potential in all operating conditions.  
5. Thermal design  
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.  
6. Inter-pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any  
connection error or if pins are shorted together.  
7. Actions in strong electromagnetic field  
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.  
8. Testing on application boards  
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.  
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or  
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.  
Use similar precaution when transporting or storing the IC.  
9. Ground Wiring Pattern  
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing  
a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused  
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern  
of any external components, either.  
10. Unused input terminals  
Connect all unused input terminals to VDD or VSS in order to prevent excessive current or oscillation.  
Insertion of a resistor (100kΩ approx.) is also recommended.  
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