REVISION E
BTH-XXX-XX-X-D-DP-EMX
ASO ONLY (APPLICATION SPECIFIC ORDER)
EDGE MOUNT THICKNESS
No OF POSITIONS
-020, -040, -060,
**-080, **-100
(PER ROW)
-EM2: .064[1.63] .004 PCB
(USE BTH-XXX-01-D-EM2 &
T-1S42-01-X)
(No OF POS x .01969[.5000] + .5868 [14.905] REF
(No OF POS x .01969[.5000]) +.1968[5.000] REF
-EM3:
*
**SEE NOTE 11
(USE BTH-XXX-01-D-EM3 &
T-1S42-02-X)
LEAD STYLE
-01
SEE NOTE 10
((No OF POS -1) x .01969[.5000])
.0030[.076]
BODY STYLE
-DP: DIFFERENTIAL PAIRS
01
PLATING SPECIFICATION
ROW SPECIFICATION
-D: DOUBLE
.155 3.94
REF
.235 5.97
REF
-F: FLASH SELECTIVE GOLD
(USE BTH-XXX-01-D-EMX)
WITH MATTE TIN TAILS
E
(USE T-1S42-XX-F) [SEE NOTE 6]
-L: LIGHT SELECTIVE GOLD
WITH MATTE TIN TAILS
02
E
.047 1.19 REF
* = NOT RELEASED FOR PRODUCTION
SEE NOTE 10
(USE T-1S42-XX-L)
FIG. 1
BTH-060-01-L-D-DP-EMX SHOWN
T-1S42-XX-X
"A"
"A"
.160 4.06
REF
.175 4.45
.118 3.00
REF
C1
"B" .003[.08]
.130 3.30 REF
.143 3.62 REF
(INSIDE TO INSIDE OF PIN)
.120 3.05 REF
.0197 0.500 REF
.058 1.47 REF
SECTION "A"-"A"
.060 1.51
.040 1.02 REF
.1408 3.575
.008 0.20 REF
2 MAX SWAY
(TYP)
PACKAGING VIEW
(PARTS TO HAVE POSITION
#1 LOADED IN SAME
DIRECTION AS
ARROW ON TUBE)
*
NOTES:
C
1.
REPRESENTS A CRITICAL DIMENSION.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
PROPRIETARY NOTE
2. BURR ALLOWANCE: .0015 MAX.
3. MINIMUM PUSHOUT FORCE: 5 OZ.
4. MAXIMUM ALLOWABLE BOW: SEE TABLE 2.
5. PARTS TO BE MOLDED TO POSITION.
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
TOLERANCES ARE:
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
TUBE: PT-1-24-01-95
PLUG: TP-03
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
DESCRIPTION:
SHEET SCALE: 2:1
MATERIAL:
DO NOT SCALE DRAWING
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
9. SEE TEK TALK GUIDE FOR PROCESSING EDGE MOUNT PARTS TO BOARD.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE
CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
.5mm DP TERMINAL ASSEMBLY, EDGE MOUNT
INSULATOR: LCP, COLOR: BLACK
TERMINAL: PHOS BRONZE
DWG. NO.
BTH-XXX-XX-X-D-DP-EMX
JOHN S
09/26/01
SHEET 1 OF 2
BY:
F:\DWG\MISC\MKTG\BTH-XXX-XX-X-D-DP-EMX-MKT.SLDDRW