Product Specification
N-Channel Enhancement Mode Field Effect Transistor
BL1N60F
Note: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature
3. L=64mH, IAS=1.2A, VDD=50V, RG=25Ω, Starting TJ =25°C
4. ISD≤1.2A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ =25°C
ELECTRICAL CHARACTERISTICS
MIN
Parameter
Symbol
Test conditions
TYP MAX UNIT
Drain-Source Breakdown Voltage
V(BR)DSS
VGS=0V,ID=250μA
600
-
-
-
V
△BVDSS
△TJ
/
Bvdss Temperature Coefficient
ID=250mA,
-
0.4
V/℃
Gate Threshold Voltage
VGS(TH)
VDS= VGS, ID =250mA
VDS=600V, VGS=0V
VDS=480V, Ta=125℃
VGS=10V,ID=0.6A
2
-
4
V
μA
Ω
-
10
Drain to Source Leakage Current
Static drain-Source on-resistance
IDSS
100
RDS(ON)
-
9.3 11.5
Gate-body Leakage
Forward
Reverse
±
VGS=±30V
IGSS
nA
S
100
Forward Transconductance
Input Capacitance
VDS=50V, ID =0.6A
gfs
-
-
-
-
-
-
-
-
-
-
-
-
0.9
-
Ciss
Coss
120 150-
VGS = 0V VDS = 25V
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
20
3.0
5
25
4.0
20
60
25
60
6.0
pF
Crss
td(ON)
tr
ID =1.2A VDD = 300V
25
7
ns
V
GS = 10V
Turn-Off Delay Time
Fall Time
td(OFF)
tf
25
5.0
1.0
2.6
160
Total Gate Charge
Qg
nC
ID =1.2A VDD =480V
GS = 10V
Gate to Source Charge
Gate to Drain (“Miller”)Charge
Reverse Recovery Time
Qgs
Qgd
trr
V
IS=1.2A,Tj = 25℃
dIF/dt=100A/us,
VGS=0V
-
-
ns
Reverse Recovery Charge
Qrr
-
0.3
nC
Note: 1. Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2%
2. Essentially Independent of Operating Temperature
MTM5001A
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