Datasheet > BGU8004

BGU8004

更新时间： 2024-01-06 07:36:52

品牌	Logo	应用领域
恩智浦 - NXP		电信电信集成电路
页数	文件大小	规格书
18页	358K
描述
SPECIALTY TELECOM CIRCUIT, PBGA6, 0.65 X 0.44 MM, 0.29 MM HEIGHT, WLCSP-6

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BGU8004 技术参数

AN11369

NXP Semiconductors

BGU8004 GNSS LNA EVB

3.2 PCB Layout

Fig 3. Printed-Circuit Board layout of the BGU8004 LNA evaluation board

A good PCB layout is an essential part of an RF circuit design. The LNA evaluation board

of the BGU8004 can serve as a guideline for laying out a board using the BGU8004. Use

controlled impedance lines for all high frequency inputs and outputs. Bypass Vcc with

decoupling capacitors, preferably located as close as possible to the device. For long

bias lines it may be necessary to add decoupling capacitors along the line further away

from the device. Proper grounding of the GND pins is also essential for good RF

performance. Either connect the GND pins directly to the ground plane or through vias,

or do both, which is recommended. The material that has been used for the evaluation

board is FR4 using the stack shown in Fig 4.

20um Cu

0.2mm FR4 critical

20um Cu

0.8mm FR4 only for

mechanical rigidity of PCB

20um Cu

(1) Material supplier is ISOLA DURAVER; εr = 4.6-4.9: Tδ = 0.02

Fig 4. Stack of the PCB material

AN11369

All information provided in this document is subject to legal disclaimers.

Application note

Rev. 1 — 10 October 2013

6 of 18

1...3 4 567 8 9...18

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