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BGU7258 PDF预览

BGU7258

更新时间: 2024-03-03 10:10:19
品牌 Logo 应用领域
恩智浦 - NXP ISM频段
页数 文件大小 规格书
21页 347K
描述
5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass

BGU7258 数据手册

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NXP Semiconductors  
BGU7258  
5 GHz ISM SiGe:C low-noise amplifier MMIC with bypass  
6 Limiting values  
Table 5.ꢀLimiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Absolute Maximum Ratings are given as limiting  
values of stress conditions during operation, that must not be exceeded under the worst case conditions.  
Symbol  
VCC  
Parameter  
Conditions  
Min Max Unit  
[1]  
[1][2][3]  
[1][2][3]  
[1][2]  
supply voltage  
RF input AC coupled  
-0.5 +5.0  
-0.5 +5.0  
-0.5 +5.0  
-0.5 +5.0  
V
V
V
V
VI(RF_IN)  
input voltage on pin RF_IN  
DC  
DC  
VI(RF_OUT) input voltage on pin RF_OUT  
VI(CTRL)  
Tstg  
input voltage on pin CTRL  
storage temperature  
-40 +150 °C  
Tj  
junction temperature  
-
-
150  
±2  
°C  
kV  
VESD  
electrostatic discharge voltage  
Human Body Model (HBM); according to the  
joint JEDEC/ESDA standard JS-001-2012  
Charged Device Model (CDM); according to  
JEDEC standard JESD22-C101  
-
±1  
kV  
Pi  
input power  
f = 5500 MHz; CW  
[1]  
[1]  
gain mode; VCC = 3.3 V  
bypass mode; VCC = 3.3 V  
-
-
10  
10  
dBm  
dBm  
[1] Stressed with pulses of 200 ms in duration in an application circuit as depicted in Figure 34.  
[2] Warning: due to internal ESD diode protection, the applied DC voltage should not exceed VCC + 0.6 V and should not exceed 5.0 V in order to avoid  
excess current.  
[3] The RF input and RF output are AC-coupled through an internal DC blocking capacitor.  
7 Thermal characteristics  
Table 6.ꢀThermal characteristics  
Symbol Parameter  
Conditions  
Typ  
Unit  
Rth(j-case) thermal resistance from junction to case  
250  
K/W  
BGU7258  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 3 — 29 August 2018  
4 / 21  
 
 
 
 
 

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