MKP 338 2 X2
Interference Suppression Film Capacitors
MKP Radial Potted Type
Vishay BCcomponents
SUB-CLAUSE NUMBER AND
TEST
CONDITIONS
PERFORMANCE REQUIREMENTS
4.4
Resistance to
soldering heat
No pre-drying
Method: 1A
Solder bath: 280 °C 5 °C
Duration: 10 s
4.19
Component solvent
resistance
Isopropylalcohol at room temperature
Method: 2
Immersion time: 5 min 0.5 min
Recovery time:
Min 1 h, max 2 h
4.4.2
Final measurements
Visual examination
No visible damage
Legible marking
Capacitance
¦ΔC/C¦ ≤ 5 % of the value measured initially.
Increase of tan δ:
Tangent of loss angle
≤ 0.008 for: C ≤ 1 µF or
≤ 0.005 for: C > 1 µF
Compared to values measured initially
Insulation resistance
As specified in section “Insulation Resistance”
this specification
of
SUB-GROUP C1B PART OF
SAMPLE OF SUB-GROUP C1
Initial measurements
Capacitance
Tangent of loss angle:
For C ≤ 1 µF at 10 kHz
For C > 1 µF at 1 kHz
Isopropylalcohol at room temperature
Method: 1
4.20
4.6
Solvent resistance
of the marking
No visible damage
Legible marking
Rubbing material: cotton wool
Immersion time: 5 min 0.5 min
Rapid change of
temperature
θA = - 55 °C
θB = + 110 °C
5 cycles
Duration t = 30 min
Visual examination
4.6.1 Inspection
No visible damage
4.7
Vibration (see note 3.1)
Mounting: see Section “Mounting” of this
specification
Procedure B4
Frequency range: 10 Hz to 55 Hz.
Amplitude: 0.75 mm or
Acceleration 98 m/s²
(whichever is less severe)
Total duration 6 h
4.7.2 Final inspection
Visual examination
No visible damage
4.9
Shock (see note 3)
Mounting: see Section “Mounting” for more
information
Pulse shape: half sine
Acceleration: 490 m/s²
Duration of pulse: 11 ms
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For technical questions, contact: rfi@vishay.com
Document Number: 28119
Revision: 16-Jul-09