Datasheet > BELASIGNA200(52QFN)

BELASIGNA200(52QFN)

更新时间： 2024-10-02 20:08:03

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
2页	256K
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BELASIGNA200(52QFN)

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BELASIGNA200(52QFN) 技术参数

生命周期：	Active	Reach Compliance Code：	compliant
风险等级：	5.12	Base Number Matches：	1

BELASIGNA200(52QFN) 数据手册

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AMI Semiconductor

BelaSigna™ 200 Single-Chip Audio Processing System

Key Features

• Up to 200 peak MIPS at 33MHz operating frequency

• Ultra-low power consumption: down to 0.05mW/MIPS

• Ultra miniaturized package options available

• Low supply voltage: 1.2V - 1.8V (CSP 1.8V only)

• Dual-Harvard 16-bit DSP core

• Dedicated filterbank coprocessor yielding equivalent

5MIPS/MHz; performs subband analysis and synthesis,

windowing, time folding, and equalization

• 8-Kwords data RAM and 12-Kwords program RAM

• Dual-channel 16-bit Σ∆ ADC/DAC with integrated

programmable amplifiers, attenuators and filters

• Programmable audio signal sampling rate up to 60kHz

• Six low-speed analog inputs (10-bit ADC, nominal

1.6kHz sampling rate)

• On-chip power management

• Programmable internal oscillator; external clock support

up to 33MHz

• Numerous digital interfaces including: GPIO, SPI, UART,

I2S, TWSS, PCM

• Package options: Evaluation PLCC, QFN52 (8 x 8mm),

CSP40 (2.3 x 3.7mm)

Product Description

This single-chip solution is ideally suited for embedded

applications where audio performance, low power

consumption and miniaturization are critical.

BelaSigna 200 targets a wide variety of digital speech-

and audio-centric products.

BelaSigna 200 is a high-performance, programmable,

mixed-signal digital signal processing (DSP) system that

is based on AMI Semiconductor’s patented second-

generation SignaKlara™ technology.

Product Benefits

Exceptional Audio Performance: Integrated single-

chip technology facilitates high-fidelity sound.

Software-Programmable: Advanced algorithms are

easily implemented with the evaluation and

development kit (EDK).

Ultra-Miniature Size: Easily embedded in even the

smallest portable devices.

Highly Cost-Effective: Single-chip contains DSP core,

coprocessor, full stereo audio signal path, memory, and

more. Encompasses a complete bill-of-material for

consumer OEM products.

Ultra-Low Power Consumption: High computational

capabilities without compromising battery life.

Fast Time-to-Market: Advanced audio and speech

processing algorithms are available. Limited external

component requirements help simplify hardware

design.

Flexible: Fully software-programmable, allowing for

OEM product variations and upgrades using the same

device.

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