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BD7F100HFN-LB PDF预览

BD7F100HFN-LB

更新时间: 2022-02-26 12:26:22
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罗姆 - ROHM /
页数 文件大小 规格书
32页 2622K
描述
Optocoupler-less Isolated Flyback Converter

BD7F100HFN-LB 数据手册

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BD7F100HFN-LB BD7F100EFJ-LB  
Description of Blocks - continued  
7. LOAD COMPENSATION  
This is the block which compensates the output voltage regulation by VF characteristic fluctuation of the secondary side  
output diode according to the load current.  
The current which flows into the built-in N-Channel MOSFET is monitored, and the current according to the compensation  
quantity and the time constant which are determined by the external resistor and the capacitor of the COMP terminal is  
drawn from the REF terminal. The output voltage rises and is rectified when feedback current which flows into the external  
resistor of the REF terminal decreases and the REF terminal voltage falls.  
8. TSD  
This is the temperature protection block.  
If the chip’s junction temperature, Tj, inside the IC is above 175°C (Typ), it will be detected and this block will be in the  
protection state and the SW terminal becomes Hi-Z.  
If Tj falls to below 150°C (Typ), it will return automatically through soft start.  
9. OCP  
This is the over-current protection block.  
If the peak current during the ON-Time of the built-in N-Channel MOSFET reaches 1.25A (Typ), it will be detected and the  
N-Channel MOSFET is turned OFF.  
If output voltage goes to 50% or less of the setting voltage, the peak detection current of OCP will be controlled by 0.625A  
(Typ).The min off time is 1.5μs (Typ) when the OCP is operated under the condition where the output voltage is 50% of  
the set voltage.  
Absolute Maximum Ratings (Ta = 25 °C)  
Rating  
Parameter  
Symbol  
Unit  
BD7F100HFN-LB  
BD7F100EFJ-LB  
VIN Input Power Voltage (Note 1)  
SW Terminal Voltage  
VIN  
VSW  
45  
60  
V
V
VIN  
SDX/EN Terminal Voltage  
FB Terminal Voltage  
VSDX/EN  
VFB  
V
VIN-0.3V to VIN  
V
REF Terminal Voltage  
COMP Terminal Voltage  
Power Dissipation  
VREF  
VCOMP  
Pd  
7
7
V
V
1.75 (Note 2)  
3.75 (Note 3)  
W
°C  
°C  
Storage Temperature Range  
Tstg  
-55 to +150  
Maximum Junction Temperature  
Tjmax  
150  
(Note 1) Not to exceed Power Dissipation (Pd).  
(Note 2) Reduced by 14.0mW/°C for temperatures above 25°C (when mounted on a one-layer glass-epoxy board with 70mm × 70mm × 1.6mm dimension,  
65% copper foil density)  
(Note 3) Reduced by 30.0mW/°C for temperatures above 25°C (when mounted on four-layer glass-epoxy board with 70mm × 70mm × 1.6mm dimension.)  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated  
over the absolute maximum ratings.  
Recommended Operating Conditions  
Limit  
Parameter  
Symbol  
Unit  
Min  
3
Typ  
24  
-
Max  
40  
VIN Input Power Voltage  
SW Terminal Voltage  
Junction Temperature (Note4)  
VIN  
VSW  
Tj  
V
V
-
50  
-40  
-
+125  
°C  
(Note 4) Life time is derated at junction temperature greater than 125°C.  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0J1J0AJ00910-1-2  
4/28  
29.Jun.2016 Rev.002  

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