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BD616LV4017ACP70 PDF预览

BD616LV4017ACP70

更新时间: 2024-01-05 08:28:02
品牌 Logo 应用领域
BSI 静态存储器
页数 文件大小 规格书
10页 267K
描述
Very Low Power/Voltage CMOS SRAM 256K X 16 bit

BD616LV4017ACP70 数据手册

 浏览型号BD616LV4017ACP70的Datasheet PDF文件第4页浏览型号BD616LV4017ACP70的Datasheet PDF文件第5页浏览型号BD616LV4017ACP70的Datasheet PDF文件第6页浏览型号BD616LV4017ACP70的Datasheet PDF文件第7页浏览型号BD616LV4017ACP70的Datasheet PDF文件第9页浏览型号BD616LV4017ACP70的Datasheet PDF文件第10页 
BSI  
BS616LV4017  
(1,6)  
WRITE CYCLE2  
t
WC  
ADDRESS  
(10)  
t
CW  
(5)  
CE  
t
BW  
LB,UB  
t
WR  
t
AW  
(3)  
t
WP  
(2)  
WE  
t
AS  
(4,11)  
t
t
OW  
(7)  
(8)  
t
WHZ  
D OUT  
t
DW  
(8,9)  
DH  
D IN  
NOTES:  
1. WE must be high during address transitions.  
2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals  
must be active to initiate a write and any one signal can terminate a write by going inactive.  
The data input setup and hold timing should be referenced to the second transition edge of  
the signal that terminates the write.  
3. TWR is measured from the earlier of CE or WE going high at the end of write cycle.  
4. During this period, DQ pins are in the output state so that the input signals of opposite phase  
to the outputs must not be applied.  
5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE  
transition, output remain in a high impedance state.  
6. OE is continuously low (OE = VIL ).  
7. DOUT is the same phase of write data of this write cycle.  
8. DOUT is the read data of next address.  
9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of  
opposite phase to the outputs must not be applied to them.  
10. TCW is measured from the later of CE going low to the end of write.  
11. The parameter is guaranteed but not 100% tested.  
Revision 2.1  
R0201-BS616LV4017  
8
Jan.  
2004  

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