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BCP53-10T-Q PDF预览

BCP53-10T-Q

更新时间: 2024-03-03 10:08:13
品牌 Logo 应用领域
安世 - NEXPERIA /
页数 文件大小 规格书
14页 279K
描述
80 V, 1 A PNP medium power transistorsProduction

BCP53-10T-Q 数据手册

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Nexperia  
BCP53T-Q series  
80 V, 1 A PNP medium power transistors  
9. Thermal characteristics  
Table 7. Thermal characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
209  
125  
97  
Unit  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
Rth(j-a)  
thermal resistance from junction to ambient  
in free air  
[1]  
[2]  
[3]  
[4]  
[5]  
-
-
-
-
-
-
-
-
97  
70  
R(j-sp)  
thermal resistance from junction to solder point  
18  
[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.  
[2] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2.  
[3] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 6 cm2.  
[4] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated and standard footprint.  
[5] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated; mounting pad for collector 1 cm2.  
aaa-023489  
3
10  
Z
th(j-a)  
(K/W)  
duty cycle = 1  
0.75  
0.50  
2
10  
0.33  
0.20  
0.10  
0.05  
10  
0.02  
0.01  
0
1
-5  
10  
-4  
-3  
10  
-2  
10  
-1  
2
3
10  
10  
1
10  
10  
10  
t
p
(s)  
FR4 PCB; single-sided copper; tin-plated and standard footprint  
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
©
BCP53T-Q_SER  
All information provided in this document is subject to legal disclaimers.  
Nexperia B.V. 2023. All rights reserved  
Product data sheet  
Rev. 1 — 14 June 2023  
5 / 14  
 
 

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