Nexperia
BCP53T-Q series
80 V, 1 A PNP medium power transistors
9. Thermal characteristics
Table 7. Thermal characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
209
125
97
Unit
K/W
K/W
K/W
K/W
K/W
K/W
Rth(j-a)
thermal resistance from junction to ambient
in free air
[1]
[2]
[3]
[4]
[5]
-
-
-
-
-
-
-
-
97
70
R(j-sp)
thermal resistance from junction to solder point
18
[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.
[2] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated and standard footprint.
[5] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated; mounting pad for collector 1 cm2.
aaa-023489
3
10
Z
th(j-a)
(K/W)
duty cycle = 1
0.75
0.50
2
10
0.33
0.20
0.10
0.05
10
0.02
0.01
0
1
-5
10
-4
-3
10
-2
10
-1
2
3
10
10
1
10
10
10
t
p
(s)
FR4 PCB; single-sided copper; tin-plated and standard footprint
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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BCP53T-Q_SER
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Nexperia B.V. 2023. All rights reserved
Product data sheet
Rev. 1 — 14 June 2023
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