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BCM43362KUBG PDF预览

BCM43362KUBG

更新时间: 2024-02-19 16:46:30
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 电信电信集成电路
页数 文件大小 规格书
60页 5201K
描述
Telecom Circuit, 1-Func, CMOS, PBGA69, WLBGA-69

BCM43362KUBG 技术参数

生命周期:Obsolete包装说明:VFBGA,
Reach Compliance Code:unknownECCN代码:5A992.C
HTS代码:8542.31.00.01风险等级:5.82
JESD-30 代码:R-PBGA-B69长度:4.52 mm
功能数量:1端子数量:69
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
座面最大高度:0.55 mm标称供电电压:1.2 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:OTHER
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM宽度:2.92 mm
Base Number Matches:1

BCM43362KUBG 数据手册

 浏览型号BCM43362KUBG的Datasheet PDF文件第2页浏览型号BCM43362KUBG的Datasheet PDF文件第3页浏览型号BCM43362KUBG的Datasheet PDF文件第4页浏览型号BCM43362KUBG的Datasheet PDF文件第5页浏览型号BCM43362KUBG的Datasheet PDF文件第6页浏览型号BCM43362KUBG的Datasheet PDF文件第7页 
CYW43362  
Single-Chip IEEE 802.11™  
b/g/n MAC/Baseband/Radio + SDIO  
The Cypress CYW43362 single-chip device provides the highest level of integration for mobile and handheld wireless systems, fea-  
turing integrated IEEE 802.11™ b/g and handheld device class IEEE 802.11n. It includes a 2.4 GHz WLAN CMOS power amplifier  
(PA) that meets the output power requirements of most handheld systems. An optional external low-noise amplifier (LNA) and exter-  
nal PA are also supported.  
Along with the integrated power amplifier, the CYW43362 also includes integrated transmit and receive baluns, further reducing the  
overall solution cost.  
Host interface options include SDIO v2.0 that can operate in 4b or 1b modes, and a generic gSPI mode.  
Utilizing advanced design techniques and process technology to reduce active and idle power, the CYW43362 is designed to  
address the needs of highly mobile devices that require minimal power consumption and compact size. It includes a power manage-  
ment unit that simplifies the system power topology and allows for operation directly from a rechargeable mobile platform battery  
while maximizing battery life.  
Features  
Single-band 2.4 GHz IEEE 802.11 b/g/n  
Security:  
Integrated WLAN CMOS power amplifier with internal  
power detector and closed-loop power control  
Hardware WAPI acceleration engine  
AES and TKIP in hardware for faster data encryp-  
tion and IEEE 802.11i compatibility  
Internal fractional-N PLL enables the use of a wide  
range of reference clock frequencies  
WPA™- and WPA2™- (Personal) support for pow-  
erful encryption and authentication  
Supports IEEE 802.15.2 external 3-wire and 4-wire  
coexistence schemes to optimize bandwidth utilization  
with other co-located wireless technologies such as  
Bluetooth, Zigbee, or BT Smart. Also supports sECI  
coexistence interface.  
69-bump WLBGA  
(4.52 mm x 2.92 mm, 0.4 mm pitch)  
Programmable dynamic power management  
Supports battery voltage range from 2.3V to 4.8V sup-  
plies with internal switching regulator  
Supports standard interfaces SDIO v2.0 (50 MHz, 4-bit  
and 1-bit) and generic SPI (up to 50 MHz)  
1 kbit One-Time Programmable (OTP) memory for  
storing board parameters  
Integrated ARM Cortex™-M3 CPU with on-chip mem-  
ory enables running IEEE 802.11 firmware that can be  
field-upgraded with future features.  
69-bump WLBGA  
(4.52 mm x 2.92 mm, 0.4 mm pitch)  
Supports WMM®, WMM-PS, and Wi-Fi Voice Per-  
sonal (upgradable to Voice Enterprise in the future)  
Figure 1. CYW43362 System Block Diagram  
VIO Vbatt  
2.4 GHz WLAN Tx  
2.4 GHz WLAN Rx  
WL_RST_N  
SDIO/SPI  
T/R  
Switch  
CBF  
WLAN Host I/F  
CYW43362  
System Clock  
Sleep Clock  
Coexistence Interface  
Cypress Semiconductor Corporation  
Document No. 002-14779 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 30, 2016  

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