Datasheet > BCM2045

BCM2045

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
博通 - BOARDCOM		蓝牙
页数	文件大小	规格书
2页	93K
描述
BLUTONIUM BLUETOOTH 2.0 + EDR SINGLE-CHIP HCI SOLUTION

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BCM2045 数据手册

BCM2045

BLUTONIUM® BLUETOOTH® 2.0 + EDR SINGLE-CHIP HCI SOLUTION

S U M M A R Y O F B E N E F I T S

F E A T U R E S

Maximizes range and simplifies system integration by

•

World’s first Bluetooth 2.0 + EDR solution in 0.13 um CMOS

technology

•

providing exceptional output power and receiver sensitivity

High-level of integration eliminates challenges of board level

RF design

Fully integrated balun and T/R switch eliminates all external

RF matching components

Achieves smallest board area requirements by minimal

external BOM and smallest package size available today

Supports class 1, 2, and 3 designs

•

Fully supports the Bluetooth 1.1, 1.2, and 2.0 standards

including 1, 2, and 3 Mbps EDR operation

•

Standard PCB requirement is less than 50 mm^2

Module solutions less than 25 mm^2

Lowest current consumption in all modes of operation

•

ROM-based solution with flexible code patching ensures fast

integration

•

ROM-based solution eliminates external flash and/or

EEPROM memory

On-chip voltage regulator lowers BOM requirements and

provides additional power savings capability

Highest available Bluetooth radio performance of any single-

chip solution

•

Minimized power dissipation over other solutions

•

88 dBm receiver sensitivity using EDR communication

Programmable output power up to +7 dBm

•

50% savings in power in standard telephony headset

applications

•

30% savings in power in advanced stereo audio applications

Minimized external BOM requirements are less than 10

external passive components

•

A P P L I C A T I O N S

Supports UART, USB, SDI, and SPI HCI transports

•

Fractional-N frequency synthesizer supports any crystal or

TCXO source from 12 to 40 MHz

Cellular and mobile communication devices

PDA and low-power embedded communication devices

PC and integration on PC mother board applications

Package types available

•

Automatic calibration and frequency detection of crystal

frequency

•

95-pin fpBGA package (6 mm x 6 mm)

65-pin fpBGA package (5 mm x 5 mm)

Wafer scale flip chip packaging

Typical Cell Phone Application

PCM

Voice Codec

UART

Handset

Baseband

BT_WAKE

HOST_WAKE

BCM2045

XTAL_PD/PU

TCXO

XTAL_IN

LPO_INPUT

LPO Clock

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