BAS70BRWP

更新时间： 2024-02-13 11:09:52

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美微科 - MCC		整流二极管肖特基二极管
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数据手册

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BAS70BRWP 数据手册

M C C

BAS40

THRU

BAS70

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

Surface Mount

Schottky Barrier Diode

200 mWatt

ꢀ

SOT-23 Package For surface mount application

Protects from line to V_CCand line to ground

Low forward voltage and reverse recovery characteristics

Bidirectional-low-forward available with “ -04” suffix (Figure 2)

Tape & Reel EIA Standard 481.

Mechanical Data

SOT-23

ꢀ

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

ꢀ

Mounting Position: Any

Weight: .008 grams (approx.)

MAXIMUM RATINGS

Operating Temperature: -55^oC to +125^oC

Storage Temperature: -55^oC to +150^oC

Power Dissipation: 200 mWatts @ T_amb=25^oC

ꢁ

_a=25 C

BAS40 I_FM=200mA

Forward Continuous Current:

Surge Forward Current: 600mA @ t_p<1s, T_amb=25^oC

=70mA

_a=25 C

BAS70

DIMENSIONS

INCHES

MIN

DIM

MAX

.120

.098

.055

.041

.081

.024

.0039

.044

.007

.020

MIN

2.80

2.10

1.20

.89

1.78

.45

.013

.89

MAX

3.04

2.64

1.40

1.03

2.05

.60

.100

1.12

.180

.51

NOTE

.110

.083

.047

.035

.070

.018

.0005

.035

.003

.015

DESCRIPTION

Various configurations of Schottky barrier’ s diodes in SOT-23

package are provided for general-purpose use in high-speed

switching ,mixers and detector applications. They may also be

used for signal integrity and counteract the transmission-line

effects with (PC) board trances by clamping over/and undershoot

from signal reflections with the schottky-low-threshold voltages.

This type of termination also does not depend on matching

the transmission line characteristic impedance, making it

particularly useful where line impendance is unknown or a

variable. This methode of termination can control distortions of

clock, data, address, and control lines as well as provides a

stabilizing effect on signal jitter. It can also significantly reduce

power consumption compared to standard resistor-based

termination methods.

.085

.37

Suggested Solder

Pad Layout

.031

.800

.035

.900

.079

inches

2.000

.037

.950

.037

.950

www.mccsemi.com

Revision: A

2011/01/01

1 of 4

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