BAS40 / -04 / -05 / -06
SMD Schottky Barrier Diode
200mW, Low VF,
Small Signal Diode
SOT-23
F
A
C
Features
B
Metal-on-silicon Shcottky Barrier
Surface device type mounting
Moisture sensitivity level 1
E
G
D
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
Unit (mm)
Unit (inch)
Min Max
Dimensions
Min
2.80
1.20
0.30
1.80
2.25
0.90
Max
Mechanical Data
Case : Flat lead SOT 23 small outline plastic package
A
B
C
D
E
F
3.00 0.110 0.118
1.40 0.047 0.055
0.50 0.012 0.020
2.00 0.071 0.079
2.55 0.089 0.100
1.20 0.035 0.043
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Weight : 0.008gram (approximately)
Marking Code : 43.44.45.46
G
0.550 REF
0.022 REF
BAS40
BAS40-04
BAS40-05
BAS40-06
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Symbol
Value
Units
mW
V
Power Dissipation
PD
200
40
Repetitive Peak Reverse Voltage
Reverse Voltage
VRRM
VR
IFRM
40
V
Repetitive Peak Forward Current
Mean Forward Current
200
mA
mA
A
IO
200
Non-Repetitive Peak Forward Surge Current (Note 1)
Thermal Resistance (Junction to Ambient) (Note 2)
Junction and Storage Temperature Range
IFSM
0.6
RθJA
TJ, TSTG
357
°C/W
°C
-65 to + 125
Electrical Characteristics
Type Number
Symbol
Min
Max
-
Units
V(BR)
40
-
V
Reverse Breakdown Voltage
IR=
10μA
0.38
0.50
1.00
0.2
5
IF=
IF=
IF=
1mA
10mA
40mA
VF
V
-
Forward Voltage
-
IR
-
μA
pF
ns
Reverse Leakage Current
Junction Capacitance
VR=
30V
CJ
-
VR=1V,
f=1.0MHz
Trr
-
5.0
Reverse Recovery Time IF =IR=10mA,RL=100Ω,IRR=1mA
Notes:1. Test Condition : 8.3ms Single half Sine-Wave Superimposed on Rated Load (JEDEC Method)
Notes:2. Valid provided that electrodes are kept at ambient temperature
Version : D11