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BA2903YFVM-C

更新时间： 2024-02-15 17:41:30
品牌 Logo 应用领域
罗姆 - ROHM 运算放大器放大器电路光电二极管
页数 文件大小 规格书
17页 362K
描述
Automotive Comparators:Ground Sense

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BA2903YFVM-C 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：MSOP
包装说明：VSSOP, TSSOP8,.16针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：33 weeks 5 days
风险等级：1.61放大器类型：COMPARATOR
最大平均偏置电流 (IIB)：0.275 µA25C 时的最大偏置电流 (IIB)：0.25 µA
最大输入失调电压：5000 µVJESD-30 代码：R-PDSO-G8
JESD-609代码：e2长度：2.9 mm
功能数量：2端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：VSSOP
封装等效代码：TSSOP8,.16封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：NOT SPECIFIED电源：+-1/+-18/2/36 V
认证状态：Not Qualified标称响应时间：1300 ns
筛选级别：AEC-Q100座面最大高度：0.9 mm
子类别：Operational Amplifier最大压摆率：2.5 mA
供电电压上限：36 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：BIPOLAR
温度等级：AUTOMOTIVE端子面层：Tin/Copper (Sn/Cu)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2.8 mmBase Number Matches：1

BA2903YFVM-C 数据手册

 浏览型号BA2903YFVM-C的Datasheet PDF文件第9页浏览型号BA2903YFVM-C的Datasheet PDF文件第10页浏览型号BA2903YFVM-C的Datasheet PDF文件第11页浏览型号BA2903YFVM-C的Datasheet PDF文件第13页浏览型号BA2903YFVM-C的Datasheet PDF文件第14页浏览型号BA2903YFVM-C的Datasheet PDF文件第15页 
Technical Note  
BA2903YF-C,BA2903YFVM-C,BA2901YF-C,BA2901YFV-C  
●Derating curves  
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated  
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that  
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.  
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal  
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum  
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame  
of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal  
resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this thermal  
resistance. Fig.51(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature  
Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below  
θja = (Tj-Ta) / Pd  
[℃/W]  
・・・・・ (Ⅰ)  
Derating curve in Fig.51(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that  
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal  
resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package  
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value  
measured at a specified condition. Fig.52(c),(d) show a derating curve for an example of BA2903Y, BA2901Y.  
Power dissipation of LSI  
[W]  
Pd (max)  
θja = ( Tj Ta ) / Pd  
[
/W]  
ー
℃
P2  
θja2 < θja1  
θ' ja2  
Ta [ ]  
℃
Ambient tem  
pe  
ra  
tu  
re  
P1  
θ ja2  
Tj ' (max) Tj (max)  
θ' ja1  
θ ja1  
Chip surface temperature Tj [  
]
℃
0
25  
50  
Ambient tem  
75  
eratu  
100  
Ta [  
125  
150  
Power dissipation  
P [W]  
]
℃
p
re  
(b) Derating curve  
(a) Thermal resistance  
Fig.51 Thermal resistance and derating curve  
1000  
800  
600  
400  
200  
0
1000  
870mW(*8)  
780mW(*6)  
590mW(*7)  
BA2901YFV-C  
800  
600  
400  
200  
0
BA2903YF-C  
610mW(*9)  
BA2901YF-C  
BA2903YFVM-C  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
AMBIENT TEMPERATURE [  
]
AMBIENT TEMPERATURE [  
]
℃
℃
(c) BA2903Y family  
(d) BA2901Y family  
(*6)  
6.2  
(*7)  
4.8  
(*8)  
7.0  
(*9)  
4.9  
Unit  
[mW/℃]  
When using the unit above Ta=25[℃], subtract the value above per degree[℃].  
Permissible dissipation is the value when FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm](cooper foil area below 3[%]) is mounted.  
Fig. 52 Derating curve  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.08 - Rev.B  
12/16  
1...9101112131415...17

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