Pressure sensors
C32 series
B58601E32**B615/…B646
Gauge pressure sensor die C32/1 (open bridge)
Handling/Mounting (dies)
Pressure sensor dies should be handled appropriately and not be touched with bare hands. They should only be picked up
manually by the sides using tweezers. Their top surface should never be touched with tweezers. Latex gloves should not be
used for handling them, as this will inhibit the curing of the adhesive used to bond the die to the carrier. When handling, be
careful to avoid cuts caused by the sharp-edged terminals. The sensor die must not be contaminated during manufacturing
processes (gluing, soldering, silk-screen process).
The package of pressure sensor dies should not to be opened until the die is mounted and should be closed after use. The
sensor die must not be cleaned. The sensor die must not be damaged during the assembly process (especially scratches on
the diaphragm).
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to different
processes employed and do not affect the specifications of the respective products. Detailed
information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
TPS PRS SD PD
2021-03-08
Please read Cautions and warnings and
Page 8 of 10
Important notes at the end of this document.