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B10S PDF预览

B10S

更新时间: 2024-09-21 09:09:27
品牌 Logo 应用领域
PACELEADER 整流二极管
页数 文件大小 规格书
2页 140K
描述
MINI SURFACE MOUNT GLASS PASSIVATED RECTIFIERS

B10S 数据手册

 浏览型号B10S的Datasheet PDF文件第2页 
B1S thru B10S  
MINI SURFACE MOUNT GLASS PASSIVATED RECTIFIERS  
VOLTAGE - 100 TO 1000 VOLTS CURRENT - 0.5 AMPERES  
FEATURES  
MECHANICAL DATA  
Plastic material used carries Underwiters  
Laboratory recognition 94V-0  
Case Reliable low cost construction utilizing molded  
plastic technique results in inexpensive product  
Terminals Lead solderable per MIL-STD-202, Method 208  
Polarity Polarity symbols molded or marking on body.  
Mounting position Any  
Low leakage  
Surge overload rating-30 amperes peak  
Ldeal for printed circuit board  
Exceeds environmental standards of MMIL-S-19500  
Weight 0.008 ounce, 0.22gram  
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS  
o
Ratings at 25 C ambient temp. unless otherwise specified  
Single phase, half sine wave, 60Hz, resistive or inductive load  
For capacitive load, derate current by 20%  
B1S  
100  
70  
B2S  
200  
140  
200  
B4S  
400  
280  
400  
B6S  
600  
420  
600  
B8S  
800  
560  
800  
B10S  
1000  
700  
UNITS  
Volts  
Maximum Recurrent Peak Reverse Voltage  
Maximum RMS Bridge input Voltage  
Maximum DC Blocking Voltage  
Volts  
Volts  
100  
1000  
Maximum Average Forward on glass-epoxy P.C.B (Note 1)  
0.5  
0.8  
Amps  
0
Current TA=30 C on aluminum substrate (Note 3)  
Peak Forward Surge Current, 8.3ms Single Half Sine-Wave  
Superimposed on Rated Load  
Amps  
30  
2
2
A t  
I t Rating fusing (t<8.35ms)  
5
1
Maximum Forward Voltage Drop per Bridge Element at 0.5A  
V
0
Maximum Reverse Current at Rated TJ=25 C  
A
5
0
DC Blocking Voltage per element TJ=125 C  
pF  
Typical Junction capacitance per leg (Note 1) CJ  
Typical Thermal resistance per leg (Note 2) R JA  
Operating Temperature Range TJ  
Storage Temperature Range TA  
NOTES  
25  
85  
0
C / W  
0
-55 to +150  
-55 to +150  
C
0
C
1. Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 Volts  
2. Thermal Resestance From Junction to Ambient and from junction to lead mounted on P.C.B with 0.05 x 0.05 (13x13mm) copper pads.  
3. On alum substrate P.C.B with an rea of 0.8x0.8x0.25 (20x20x6.4mm) mounte on 0.05x0.05 (13x13mm) solder pad.  
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