是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | TFBGA, | Reach Compliance Code: | compliant |
Factory Lead Time: | 10 weeks | 风险等级: | 5.77 |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 32 | 最大时钟频率: | 20 MHz |
DAC 通道: | YES | DMA 通道: | YES |
外部数据总线宽度: | JESD-30 代码: | S-PBGA-B100 | |
长度: | 9 mm | I/O 线路数量: | 79 |
端子数量: | 100 | 片上程序ROM宽度: | 8 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | ROM可编程性: | FLASH |
筛选级别: | TS 16949 | 座面最大高度: | 1.1 mm |
速度: | 48 MHz | 最大供电电压: | 1.95 V |
最小供电电压: | 1.62 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
宽度: | 9 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ATSAM3N0B | MICROCHIP | Microchip's SAM3N0B is a member of the SAM3N series of microcontrollers based on the high |
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|
ATSAM3N0BA-AU | ATMEL | ARM-based Flash MCU |
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|
ATSAM3N0BA-MU | ATMEL | ARM-based Flash MCU |
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|
ATSAM3N0C | MICROCHIP | Microchip's SAM3N0C is a member of the SAM3N series of microcontrollers based on the high |
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|
ATSAM3N0CA-AU | ATMEL | ARM-based Flash MCU |
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|
ATSAM3N0CA-CU | ATMEL | ARM-based Flash MCU |
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