Datasheet > ATB3225-75032CT

ATB3225-75032CT

更新时间： 2024-01-31 03:28:28

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
7页	115K
描述
Wound Chip Baluns

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技术参数
数据手册

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ATB3225-75032CT 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	ROHS COMPLIANT PACKAGE-6	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8504.50.80.00
风险等级：	8.58	变压器类型：	RF TRANSFORMER
Base Number Matches：	1

ATB3225-75032CT 数据手册

(1/6)

Conformity to RoHS Directive

Wound Chip Baluns

ATB Series ATB3225-75011CT

FEATURES

PRODUCT IDENTIFICATION

• Case size of ATB3225 is L3.2W2.5H2.3mm.

• This case size is smaller than traditional Balun.

• Frequency band width is 5 to 200MHz.

• Low insertion loss and good balance parameter.

• It is a product conforming to RoHS directive.

ATB 3225 - 750 11 CT

(1)

(2)

(3) (4) (5)

(1) Series name

(2) Case size

(3) Impedance[at 100MHz]

750: 75

APPLICATIONS

Cable modems

(4) Impedance ratio

11 → 1:1

(5) Type

SHAPES AND DIMENSIONS

3.2 0.2

CT: Center tap

TEMPERATURE RANGES

Mark for direction

Operating

Storage(After mount)

–25 to +85°C

RECOMMENDED SOLDERING CONDITIONS

RECOMMENDED TEMPERATURE PROFILE

FOR LEAD-FREE SOLDER

Peak 245˚C max.

Natural

cooling

230˚C

0.45

180˚C

150˚C

60 to 120s

10 to 30s

( )

Time s

Dimensions in mm

REFLOW PROFILE FOR SOLDER HEAT RESISTANCE

RECOMMENDED PC BORARD PATTERN

Peak 260˚C max.

Natural

cooling

1.0

2.0

230˚C

180˚C

150˚C

60 to 120s

40s max.

4.0

Dimensions in mm

( )

Time s

CIRCUIT DIAGRAM

Unbalance port

Balance port

GND

Vcc

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• All specifications are subject to change without notice.

001-02 / 20120628 / e751_woundbalun_atb3225

123 4 5 6 7

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