是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | 15 X 15 MM, 0.80 MM PITCH, GREEN, MO-205, LFBGA-217 | 针数: | 217 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.73 |
具有ADC: | NO | 其他特性: | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度: | 26 | 位大小: | 32 |
CPU系列: | ARM9 | 最大时钟频率: | 50 MHz |
DAC 通道: | NO | DMA 通道: | YES |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B217 |
JESD-609代码: | e8 | 长度: | 15 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 96 |
端子数量: | 217 | 片上程序ROM宽度: | |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA217,17X17,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.2,1.8,3.3 V |
认证状态: | Not Qualified | RAM(字节): | 163840 |
ROM(单词): | 0 | ROM可编程性: | FLASH |
座面最大高度: | 1.4 mm | 速度: | 240 MHz |
子类别: | Microcontrollers | 最大供电电压: | 1.32 V |
最小供电电压: | 1.08 V | 标称供电电压: | 1.2 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 15 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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