Datasheet > AS1313-BTDM-33

AS1313-BTDM-33

更新时间： 2022-02-26 10:32:45

品牌	Logo	应用领域
艾迈斯 - AMSCO		/
页数	文件大小	规格书
26页	568K
描述
Wide input voltage range (2.4V to 5.5V)

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数据手册

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AS1313-BTDM-33 数据手册

AS1313 − Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Temperature Ranges and Storage Conditions

WL-CSP

MLPD

°C/W

°C

(1)

Thermal resistance

Operating temperature

-40

-55

AMB

WL-CSP

MLPD

°C

Junction

temperature

150

125

°C

Storage temperature range

WL-CSP

°C

STRG

(2)

Norm IPC/JEDEC J-STD-020

Package body

temperature

Norm IPC/JEDEC J-STD-020

The lead for Pb-free leaded

packages is matte tin

(100% Sn)

260

°C

BODY

MLPD

Relative humidity

non-condensing

Represents an unlimited floor

life time

WL-CSP

MLPD

Moisture sensitivity

level

MSL

Represents an unlimited floor

life time

Note(s) and/or Footnote(s):

1. Junction-to-ambient thermal resistance is very dependent on application and board-layout. In situations where high maximum

power dissipation exists, special attention must be paid to thermal dissipation during board design.

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”.

ams Datasheet

Page 5

[v1-43] 2015-Jul-23

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