Datasheet > AS1312-BWLT-50

AS1312-BWLT-50

更新时间： 2022-05-10 13:28:46

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艾迈斯 - AMSCO		/
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描述
Ul t ra Low Quiescent Cur rent , Hysteret ic DC-DC Step-Up Conver ter

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AS1312-BWLT-50 数据手册

AS1312

Datasheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Electrical Parameters

Min

Max

Units

Comments

VIN, VOUT, EN, LBI, LBO to GND

LX, REF to GND

-0.3

-100

OUT + 0.3

Input Current (latch-up immunity)

100

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

Temperature Ranges and Storage Conditions

TDFN

±2

Norm: MIL 883 E method 3015

Junction-to-ambient thermal resistance is very

dependent on application and board-layout. In

situations where high maximum power dissipation

exists, special attention must be paid to thermal

dissipation during board design.

Thermal Resistance θ_JA

ºC/W

WL-CSP

Junction Temperature

+125

+150

+125

ºC

-55

for 8-pin (2x2) TDFN

for 8-pin WL-CSP

Storage Temperature Range

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

Package Body Temperature

+260

ºC

The lead finish for Pb-free leaded packages is matte

tin (100% Sn).

Humidity non-condensing

Moisture Sensitive Level

Represents a maximum floor life time of unlimited

www.ams.com/DC-DC_Step-Up

Revision 1.12

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1 234 5 6 7...20

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