RS (ARS)
NOTES
1. Coil operating power
Single side stable silent type
*Relays are influenced by the type of PC
board used. Please confirm with the
actual PC board you plan to use.
*Please avoid reflow soldering.
Pure DC current should be applied to the
coil. The wave form should be
rectangular. If it includes ripple, the ripple
factor should be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different. The nominal operating voltage
should be applied to the coil for more
than 30 ms to set/reset the latching type
relay.
Humidity, %R.H.
85
2) Surface-mount terminal
Tolerance range
In case of automatic soldering, the
following conditions should be observed
(1) Position of measuring temperature
(Avoid freezing (Avoid
when used at
temperatures
lower than
0°C 32°F)
condensation
when used at
temperatures
higher than
0°C 32°F)
A
5
-40
-40
0
32
60
140
Temperature, °C °F
2. Coil connection
When connecting coils, refer to the wiring
diagram to prevent mis-operation or
malfunction.
A: Surface of PC board where relay is mounted.
4) Condensation
Condensation forms when there is a
sudden change in temperature under
high temperature and high humidity
conditions. Condensation will cause
deterioration of the relay insulation.
5) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0°C 32°F. This causes
problems such as sticking of movable
parts or operational time lags.
6) Low temperature, low humidity
environments
The plastic becomes brittle if the relay is
exposed to a low temperature, low
humidity environment for long periods of
time.
(2) IR (infrared reflow) soldering method
T3
3. External magnetic field
T1=150 to 180°C
Since RS relays are highly sensitive
polarized relays, their characteristics will
be affected by a strong external magnetic
field. Avoid using the relay under that
condition.
T2
T2=230°C and higher
T1
T3=250°C max.
t1=60s to 120s
t2=within 30s
t1
t2
4. Cleaning
• Mounting cautions
For automatic cleaning, the boiling
method is recommended. Avoid
ultrasonic cleaning which subjects the
relays to high frequency vibrations, which
may cause the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Conditions for operation, transport
and storage conditions
1) Temperature
Rise in relay temperature depends
greatly on the component mix on a given
PC board and the heating method of the
reflow equipment. Therefore, please test
beforehand using actual equipment to
ensure that the temperature where the
relay terminals are soldered and the
temperature at the top of the relay case
are within the conditions given above.
3) Please meet the following conditions if
this relay is to be soldered by hand.
(1) 260°C 500°F for max. 10 seconds
(2) 350°C 662°F for max. 3 seconds
The effect on the relay depends on the
actual substrate used. Please verify the
substrate to be used.
7) Storage requirements
Since the relay is sensitive to humidity,
the surface-mount type is packaged with
tightly sealed anti-humidity packaging.
However, when storing, please be careful
of the following.
• Single side stable standard and latching
type: –40 to 70°C –40 to 158°F
• Single side stable silent type:
–40 to 60°C –40 to 140°F
2) Humidity: 5 to 85% RH
(1) Please use promptly once the anti-
humidity pack is opened.
(Avoid freezing and condensation.)
The humidity range varies with the
temperature. Use within the range
indicated in the graph below.
3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for
usage, transport, and storage:
Single side stable standard
If relays are left as is after unpacking,
they will absorb moisture which will result
in loss of air tightness as a result of case
expansion due to thermal stress when
reflow soldering during the mounting
process. (within one day, 30°C and
60%R.H or less)
(2) When storing for a log period after
opening the anti-humidity pack, storage
in anti-humidity packaging with an anti-
humidity bag to which silica gel has been
added, is recommended.
*Furthermore, if the relay is solder
mounted when it has been subjected to
excessive humidity, cracks and leaks can
occur. Be sure to mount the relay under
the required mounting conditions.
6. Soldering
(3) Avoid ultrasonic cleaning. Doing so
will adversely affect relay characteristics.
Please use alcohol-based cleaning
solvents when cleaning relays.
7.Tape and reel packing
1) Tape dimensions
8.6
.339
1.5+0.1 dia.
0
.059+0.004 dia.
2.0
1.75 8.3
and latching type
.079
16.0
.630
.069
.327
12.0
.472
RS relay
4.0
.157
0.4
.016
Humidity, %R.H.
11.5
.453
15.00
.591
X type
Z type
85
24.0 0.3
.945 .012
Tape coming out direction
Relay polarity bar
Tolerance range
(Avoid freezing (Avoid
when used at
temperatures
lower than
0°C 32°F)
condensation
when used at
temperatures
higher than
0°C 32°F)
(General tolerance: 0.1 .004)
2) Dimensions of plastic reel
5
21 0.8 dia.
.827 .031dia.
-40
-40
0
70
158
32
Temperature, °C °F
1) Please meet the following conditions if
this relay is to be automatically soldered.
(1) Preheating: Max. 120°C 248°F
(terminal solder surface) for max. 120
seconds
380 2 dia.
0.5
2.0
.020
14.961 .079 dia.
.079
80 1 dia.
3.150 .039 dia.
(2) Soldering: Max. 260 5°C 500 9°F for
max. 6 seconds
13 0.2 dia.
.512 .008dia.
24.4+20.0
.961+.0079
0.2
2.0
.008
.079
ASCTB106E 201202-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
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