Datasheet > APX9136QFI-TRG

APX9136QFI-TRG

更新时间： 2024-01-21 03:13:01

品牌	Logo	应用领域
茂达 - ANPEC		输出元件传感器换能器
页数	文件大小	规格书
12页	198K
描述
Hall Effect Micro Switch IC

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技术参数
数据手册

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APX9136QFI-TRG 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	1.60 X 1.60 MM, GREEN, VTDFN-6
Reach Compliance Code：	compliant	风险等级：	5.78
主体宽度：	1.6 mm	主体高度：	0.55 mm
主体长度或直径：	1.6 mm	滞后：	1 mT
JESD-609代码：	e3	最大磁场范围：	4.5 mT
最小磁场范围：	1 mT	安装特点：	SURFACE MOUNT
最大工作电流：	0.01 mA	最高工作温度：	85 °C
最低工作温度：	-40 °C	输出范围：	0.04-2.6V
输出类型：	DIGITAL OUTPUT	封装形状/形式：	SQUARE
传感器/换能器类型：	MAGNETIC FIELD SENSOR,HALL EFFECT	最大供电电压：	3.5 V
最小供电电压：	1.6 V	表面贴装：	YES
端子面层：	Matte Tin (Sn)	端接类型：	SOLDER
Base Number Matches：	1

APX9136QFI-TRG 数据手册

APX9136

Application Information

It is strongly recommended that an external bypass ca-

pacitor can be connected (is close to the Hall sensor)

between the supply and the ground of the device to re-

duce both external noise and noise generated by the chop-

per-stabilization technique. This is especially true due to

the relatively high impedance of battery supplies.

Pole-independent

The pole-independent sensing technique allows for op-

eration with either a north or a south pole magnet

orientation, enhancing the manufacturability of the device.

The state-of-the-art technology provides the same output

polarity for either pole in presence.

Awake & Sleep

Internal awake & sleep timing block circuit activates the

sensor for 180ms and deactivates it for the remainder of

the period (60ms). A short “awake” time allows for stabi-

lization prior to the sensor sampling and data latching on

the falling edge of the timing pulse. While in sleep cycle,

the output is latched in its previous state.

Chopper Stabilized Technique

The chopper stabilized technique cancels the mismatch-

ing of the hall element, the amplifier offset voltage and

temperature sensitive drift by the dynamic offset cancel-

lation and switched capacitor technique. This technique

produces devices has an extremely stable Hall output

voltage, therefore, the magnetic switch points are stable.

Recommended Minimum Footprint

The PCB SMD process maybe cause huger thermal

stress on IC chip through exposed pad, so the recom-

mended PCB layout footprint is without exposed pad.

2.0

0.45

0.25

0.5

1.6

U nit:m m

VTDFN1.6x1.6-6

www.anpec.com.tw

Rev. A.3 - Jun., 2015

1...4 5 678 9 10...12

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