Datasheet > APM0942-P29

APM0942-P29

更新时间： 2024-10-02 06:37:27

品牌	Logo	应用领域
ASB		放大器功率放大器
页数	文件大小	规格书
5页	1087K
描述
Medium Power Amplifier Module

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中文翻译

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数据手册

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APM0942-P29 数据手册

plerow^TMAPM0942-P29

High OIP3

Medium Power Amplifier Module

Features

· S₂₁= 31.4 dB @ 925 MHz

Description

The plerow^TMAPM-Series is an internally matched

amplifier mini-module for such application band in

SMD package with the output P1dB of 29 dBm. It is

compactly designed for low current consumption and

high OIP3. Integrating all the components for biasing

and matching within the module enhances production

yield and throughput as well. It passes through the

stringent DC, RF, and reliability tests. Not sample test

but 100% quality control test is made before packing.

= 30.6 dB @ 960 MHz

· NF of 6.6 dB over Frequency

· Unconditionally Stable

· Single 5V Supply

· High OIP3 @ Low Current

Specifications (in Production)

Typ. @ T = 25°C, V_s= 5 V, Freq. = 942.5 MHz, Z_o.sys= 50 ohm

1-stage Single Type

Specifications

Parameter

Unit

Min

925

Typ

Max

960

Frequency Range

Gain

MHz

± 0.4

6.6

More Information

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Gain Flatness

Noise Figure

Output IP3 ⁽¹⁾

S11 / S22 ⁽²⁾

± 0.5

6.8

dBm

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

-14 / -9

400

Output P1dB

Switching Time ⁽³⁾

Supply Current

Supply Voltage

Impedance

dBm

µsec

ASB Inc., 4th Fl. Venture Town

Bldg., 367-17 Goijeong-Dong,

Seo-Gu, Daejon 302-716, Korea

370

Ω

Max. RF Input Power

Package Type & Size

dBm

C.W 23 ~ 25 (before fail)

Surface Mount Type, 10Wx10Lx3.8H

Operating temperature is -40°C to +85°C.

1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz.

2) S11/S22 (max) is the worst value within the frequency band.

3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V_S.

Outline Drawing (Unit: mm)

plerow

APM0942-P29

Pin Number

Function

RF In

RF Out

ASB Inc.

(Top View)

(Bottom View)

Others

Ground

Solder Stencil Area

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

(Side View)

Ø0.3 plated thru holes to ground plane

2 x Ø2.0 plated thru holes to screw on heat sinker

(Recommended Footprint)

1/5

www.asb.co.kr

February 2008

12 3 4 5

中文翻译

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