AMMP-6220-BLK

更新时间： 2024-02-04 12:44:31

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AMMP-6220-BLK 技术参数

onto the PCB pads. The recommended stencil layout is

shown in Figure 24. The stencil has a solder paste deposi-

tion opening approximately 70% to 90% of the PCB pad.

Reducing stencil opening can potentially generate more

voids underneath. On the other hand, stencil openings

larger than 100% will lead to excessive solder paste

smear or bridging across the I/O pads. Considering the

fact that solder paste thickness will directly aﬀect the

quality of the solder joint, a good choice is to use a laser

cut stencil composed of 0.127 mm (5 mils) thick stainless

steel which is capable of producing the required ﬁne

stencil outline. The combined PCB and stencil layout is

shown in Figure 25.

Recommended SMT Attachment

The AMMP Packaged Devices are compatible with high

volume surface mount PCB assembly processes.

The PCB material and mounting pattern, as deﬁned in the

data sheet, optimizes RF performance and is strongly rec-

ommended. An electronic drawing of the land pattern

is available upon request from Avago Sales & Application

Engineering.

Stencil Design Guidelines

A properly designed solder screen or stencil is required

to ensure optimum amount of solder paste is deposited

Figure 23. Suggested PCB Land Pattern and Stencil Layout

Figure 25. Combined PCB and Stencil Layouts

Figure 24. Stencil Outline Drawing (mm)

1...5 6 789 10

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型号	品牌	描述	获取价格	数据表
AMMP-6220-TR1	AVAGO	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR1	AGILENT	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR2	AGILENT	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6220-TR2	AVAGO	6-20 GHz Low Noise Amplifier	获取价格
AMMP-6222	AVAGO	7 to 21 GHz GaAs High Linearity LNA in SMT Package	获取价格
AMMP-6222-BLKG	AVAGO	7 to 21 GHz GaAs High Linearity LNA in SMT Package	获取价格