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AMMP-5620 PDF预览

AMMP-5620

更新时间: 2024-01-07 18:25:30
品牌 Logo 应用领域
安华高科 - AVAGO 放大器
页数 文件大小 规格书
12页 525K
描述
6 20 GHz High Gain Amplifier in SMT Package

AMMP-5620 数据手册

 浏览型号AMMP-5620的Datasheet PDF文件第6页浏览型号AMMP-5620的Datasheet PDF文件第7页浏览型号AMMP-5620的Datasheet PDF文件第8页浏览型号AMMP-5620的Datasheet PDF文件第9页浏览型号AMMP-5620的Datasheet PDF文件第11页浏览型号AMMP-5620的Datasheet PDF文件第12页 
Manual Assembly  
1. Follow ESD precautions while handling packages.  
2. Handling should be along the edges with tweezers.  
3. Recommended attachment is conductive solder paste.  
Please see recommended solder reflow profile.  
Conductive  
epoxy is not recommended. Hand soldering is not  
recommended.  
4. Apply solder paste using a stencil printer or dot  
placement.  
ThevolumeofsolderpastewillbedependentonPCBand  
component layout and should be controlled to ensure  
consistent mechanical and electrical performance.  
5. Follow solder paste and vendor’s recommendations  
when developing a solder reflow profile. A standard  
profile will have a steady ramp up from room  
temperature to the pre-heat temperature to avoid  
damage due to thermal shock.  
6. Packages have been qualified to withstand a peak  
temperature of 260°C for 20 seconds. Verify that the  
profile will not expose device beyond these limits.  
Outline Drawing  
0.114 (2.90)  
0.018 (0.46)  
0.011 (0.28)  
0.014 (0.365)  
3
2
1
1
2
3
*
0.016 (0.40)  
AMMP  
XXXX  
YWWDNN  
8
4
0.126  
(3.2)  
0.059  
(1.5)  
A
8
4
0.100 (2.54)  
0.012 (0.30)  
0.029 (0.75)  
5
6
7
7
6
5
0.016 (0.40)  
0.100 (2.54)  
A
B
0.028 (0.70)  
FRONT VIEW  
SIDE VIEW  
0.93 (2.36)  
SYMBOL  
MIN.  
MAX.  
BACK VIEW  
A
B
0.198 (5.03)  
0.0685 (1.74)  
0.213 (5.4)  
0.088 (2.25)  
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)  
DIMENSIONS ARE IN INCHES (MM)  
NOTES:  
1. INDICATES PIN 1  
*
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)  
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND  
Figure 24.Outline Drawing.  
ꢀ0  

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