Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile.
Conductive
epoxy is not recommended. Hand soldering is not
recommended.
4. Apply solder paste using a stencil printer or dot
placement.
ThevolumeofsolderpastewillbedependentonPCBand
component layout and should be controlled to ensure
consistent mechanical and electrical performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temperature to avoid
damage due to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
Outline Drawing
0.114 (2.90)
0.018 (0.46)
0.011 (0.28)
0.014 (0.365)
3
2
1
1
2
3
*
0.016 (0.40)
AMMP
XXXX
YWWDNN
8
4
0.126
(3.2)
0.059
(1.5)
A
8
4
0.100 (2.54)
0.012 (0.30)
0.029 (0.75)
5
6
7
7
6
5
0.016 (0.40)
0.100 (2.54)
A
B
0.028 (0.70)
FRONT VIEW
SIDE VIEW
0.93 (2.36)
SYMBOL
MIN.
MAX.
BACK VIEW
A
B
0.198 (5.03)
0.0685 (1.74)
0.213 (5.4)
0.088 (2.25)
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
DIMENSIONS ARE IN INCHES (MM)
NOTES:
1. INDICATES PIN 1
*
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
Figure 24.Outline Drawing.
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