Datasheet > 射频和微波 > 射频/微波放大器> AMMC-5620-W50

AMMC-5620-W50

更新时间： 2024-01-19 06:32:05

品牌	Logo	应用领域
安捷伦 - AGILENT		射频和微波射频放大器微波放大器
页数	文件大小	规格书
8页	184K
描述
Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier

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技术参数
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AMMC-5620-W50 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	DIE OR CHIP	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.33.00.01
风险等级：	5.1	Is Samacsys：	N
特性阻抗：	50 Ω	构造：	COMPONENT
增益：	16 dB	最大输入功率 (CW)：	20 dBm
功能数量：	1	最大工作频率：	20000 MHz
最小工作频率：	6000 MHz	封装等效代码：	DIE OR CHIP
电源：	5 V	射频/微波设备类型：	WIDE BAND LOW POWER
子类别：	RF/Microwave Amplifiers	最大压摆率：	130 mA
技术：	GAAS	Base Number Matches：	1

AMMC-5620-W50 数据手册

Biasing and Operation

Assembly Techniques

Thermosonic wedge bonding is

the preferred method for wire

attachment to the bond pads.

Gold mesh can be attached

using a 2 mil round tracking

tool and a tool force of

approximately 22 grams with an

ultrasonic power of roughly 55

dB for a duration of 76 8 mS.

A guided wedge at an ultrasonic

power level of 64 dB can be

used for the 0.7 mil wire. The

recommended wire bond stage

temperature is 150 2 °C.

The AMMC-5620 is normally

biased with a single positive

drain supply connected to the

The backside of the AMMC-5620

chip is RF ground. For

microstripline applications, the

chip should be attached directly

to the ground plane (e.g., circuit

bond pads shown in Figure

19. The recommended supply

voltage is 5 V, which results in

carrier or heatsink) using

electrically conductive epoxy

[1]

= 95 mA (typical).

No ground wires are required

because all ground connections

are made with plated through-

holes to the backside of the

device.

For best performance, the

topside of the MMIC should be

brought up to the same height

as the circuit surrounding it.

This can be accomplished by

mounting a gold plated metal

shim (same length and width as

the MMIC) under the chip,

which is of the correct

Refer the Absolute Maximum

Ratings table for allowed DC

and thermal conditions.

Caution should be taken to not

exceed the Absolute Maximum

Rating for assembly temperature

and time.

thickness to make the chip and

adjacent circuit coplanar.

The chip is 100 µm thick and

should be handled with care.

This MMIC has exposed air

bridges on the top surface and

should be handled by the edges

or with a custom collet (do not

pick up die with vacuum on die

center.)

The amount of epoxy used for

chip and or shim attachment

should be just enough to

provide a thin fillet around the

bottom perimeter of the chip or

shim. The ground plane should

be free of any residue that may

jeopardize electrical or

mechanical attachment.

This MMIC is also static

sensitive and ESD handling

precautions should be taken.

The location of the RF bond

pads is shown in Figure 20.

Note that all the RF input and

output ports are in a Ground-

Signal-Ground configuration.

Notes:

1. Ablebond 84-1 LM1 silver epoxy is

recommended.

2. Buckbee-Mears Corporation, St. Paul, MN,

800-262-3824

RF connections should be kept

as short as reasonable to

minimize performance

degradation due to undesirable

series inductance. A single bond

wire is sufficient for signal

connections, however double-

bonding with 0.7 mil gold wire

[2]

or the use of gold mesh is

recommended for best

performance, especially near the

high end of the frequency range.

1...3 4 567 8

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AMMC-6120	BOARDCOM	8 â 24 GHz Output Ã 2 Active Frequency Mul	获取价格
AMMC-6120-W10	BOARDCOM	8 â 24 GHz Output Ã 2 Active Frequency Mul	获取价格
AMMC-6120-W50	AVAGO	8000MHz - 20000MHz RF/MICROWAVE FREQUENCY DOUBLER, 0.064 X 0.040 INCH, DIE	获取价格
AMMC-6120-W50	BOARDCOM	8 â 24 GHz Output Ã 2 Active Frequency Mul	获取价格
AMMC-6140	AVAGO	20â40 GHz Output x2 Active Frequency Multip	获取价格
AMMC-6140	BOARDCOM	20â40 GHz Output x2 Active Frequency Multip	获取价格

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