AMMC-6140
20 – 40 GHz Output x2 Active Frequency Multiplier
Data Sheet
Chip Size:
1300 x 900 µm (51 x 35 mils)
10 µm ( 0.4 mils)
100 10 µm (4 0.4 mils)
120 x 80 µm (5x3 0.4 mils)
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
Description
Features
Avago’s AMMC-6140 is an easy-to-use x2 active frequency
multiplier MMIC designed for commercial communica-
tion systems. The MMIC takes a 10 to 20 GHz input signal
and doubles it to 20 to 40 GHz. It could also be used
• Input frequency range: 10–20 GHz
• Broad input power range: -9 to +7 dBm
• Output power: -1 to 0 dBm (Pin=+4dB)
between 9–10 GHz and 20–22 GHz with slight degrada- • Fundamental suppression of 25 dBc
tion in Conversion Loss or Fundamental Suppression. It
has an integrated matching, harmonic suppression, and
bias network. The input/output are matched to 50Ω and
• 50Ω input and output match
• Supply bias of -1.2V, 4.5V and 27 mA
fully DC blocked. The MMIC is fabricated using PHEMT
technology. The backside of this die is both RF and DC
ground. This helps simplify the assembly process and
Applications
• Microwave radio systems
reduces assembly-related performance variations and
costs. For improved reliability and moisture protection,
the die is passivated at the active areas. This MMIC is a
cost effective alternative to bulky hybrid FET and diode
doublers that require high input drive levels, have high
conversion loss and poor fundamental suppression.
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access
(including 802.16 and 802.20 WiMax)
• WLL and MMDS loops
Absolute Maximum Ratings[1]
Symbol Parameters/Conditions
Units
V
Min.
Max.
7
Vd
Positive Drain Voltage
Gate Supply Voltage
Drain Current
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Vg
V
-3.0
0.5
Id
mA
dBm
°C
-3
Pin
Tch
Tstg
Tmax
CW Input Power
15
Operating Channel Temperature
Storage Case Temperature
+150
+150
+300
°C
-65
Maximum Assembly Temp
(60 sec max)
°C
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.