AMMC-6120
8 – 24 GHz Output × 2
Active Frequency Multiplier
Data Sheet
Chip Size: 1600 x 1000 µm (64 x 40 mils)
Chip Size Tolerance: 10 µm ( 0.4 mils)
Chip Thickness: 100 10 µm (4 0.4 mils)
Pad Dimensions: 120 x 80 µm (5x3 0.4 mils)
Description
Features
• Input frequency range: 4-10 GHz
• Broad input power range: -11 to +5dBm
• Output power: +14 dBm (Pin=+3dBm)
• Fundamental Suppression of 25 dBc
• 50 Ω input and output match
Avago Technologies' AMMC-6120 is an easy-to-use x2
active frequency multiplier MMIC designed for com-
mercial communication systems. Though capable of
doubling to 24 GHz with reduced fundamental suppres-
sion, the MMIC is designed to take a 4 to 10 GHz input
and double it to 8 to 24 GHz. It has integrated output
amplifier, matching harmonic suppression, and bias
networks. The input/output are matched to 50 Ω
and fully DC blocked. The MMIC is fabricated using
PHEMT technology. The backside of this die is both RF
and DC ground. This helps simplify the assembly process
and reduces assembly related performance variations
and costs. For improved reliability and moisture protec-
tion, the die is passivated at the active areas. This MMIC is
a cost effective alternative to bulky hybrid FET and diode
doublers that require high input drive power, have high
C.L. and poor fundamental suppression.
• Supply bias of -1.4V, 5V and 85mA
Applications
• Microwave radio systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access
(including 802.16 and 802.20 WiMax)
• WLL and MMDS loops
[1]
AMMC-6120 Absolute Maximum Ratings
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
Symbol Parameters/Conditions
Units Min. Max.
Vd
Positive Drain Voltage
Gate Supply Voltage
Drain Current
V
7
Vg
V
-3.0
0.5
Id
mA
dBm
°C
120
15
Pin
Tch
Tstg
Tmax
CW Input Power
Operating Channel Temp.
Storage Case Temp.
+150
+150
+300
°C
-65
Maximum Assembly Temp. °C
(60 sec. max.)
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.