Datasheet > AMIS30621C6216G

AMIS30621C6216G

更新时间： 2024-02-22 05:29:08

品牌	Logo	应用领域
安森美 - ONSEMI		驱动器电机
页数	文件大小	规格书
59页	639K
描述
Micro-Stepping Motor Driver

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AMIS30621C6216G 技术参数

是否无铅：	不含铅	生命周期：	Not Recommended
零件包装代码：	QFN	包装说明：	HVQCCN, LCC32,.27SQ,25
针数：	32	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.09	模拟集成电路 - 其他类型：	STEPPER MOTOR CONTROLLER
JESD-30 代码：	S-XQCC-N32	JESD-609代码：	e3
长度：	7 mm	湿度敏感等级：	3
功能数量：	1	端子数量：	32
封装主体材料：	UNSPECIFIED	封装代码：	HVQCCN
封装等效代码：	LCC32,.27SQ,25	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	6.5/29 V	认证状态：	Not Qualified
座面最大高度：	0.9 mm	子类别：	Motion Control Electronics
最大供电电流 (Isup)：	10 mA	最大供电电压 (Vsup)：	29 V
最小供电电压 (Vsup)：	6.5 V	标称供电电压 (Vsup)：	8 V
表面贴装：	YES	端子面层：	Tin (Sn)
端子形式：	NO LEAD	端子节距：	0.65 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7 mm	Base Number Matches：	1

AMIS30621C6216G 数据手册

AMIS−30621

PACKAGE THERMAL RESISTANCE

The AMIS−30621 is available in SOIC−20 and optimized

The major thermal resistances of the device are the Rth

from the junction to the ambient (Rthja) and the overall Rth

from the junction to the leads (Rthjp).

The NQFP device is designed to provide superior thermal

performance. Using an exposed die pad on the bottom

surface of the package, is mainly contributing to this

performance. In order to take full advantage of the exposed

pad, it is most important that the PCB has features to conduct

heat away from the package. A thermal grounded pad with

thermal vias can achieve this.

NQFP32 packages. For cooling optimizations, the NQFP

has an exposed thermal pad which has to be soldered to the

PCB ground plane. The ground plane needs thermal vias to

conduct the head to the bottom layer. Figures 3 and 4 give

examples for good power distribution solutions.

For precise thermal cooling calculations the major

thermal resistances of the devices are given. The thermal

media to which the power of the devices has to be given are:

• Static environmental air (via the case)

In below table, one can find the values for the Rthja and

Rthjp, simulated according to the JESD−51standard:

• PCB board copper area (via the device pins and

exposed pad)

The thermal resistances are presented in Table 5: DC

Parameters.

Rth

Junction−to−Leads and

Exposed Pad (Rthjp)

Junction−to−Leads

(Rthjp)

Junction−to−Ambient

Rthja 1S0P

Junction−to−Ambient

Rthja 2S2P

Package

SOIC−20

NQFP−32

0.95

The Rthja for 2S2P is simulated conform to JESD−51 as

follows:

The Rthja for 1S0P is simulated conform to JESD−51 as

follows:

• A 4−layer printed circuit board with inner power planes

and outer (top and bottom) signal layers is used

• A 1−layer printed circuit board with only 1 layer

• Board thickness is 1.46 mm (FR4 PCB material)

• The layer has a thickness of 70 mm copper with an area

• The 2 signal layers: 70 mm thick copper with an area of

of 5500 mm copper and 20% conductivity

5500 mm copper and 20% conductivity

• The 2 power internal planes: 36 mm thick copper with

an area of 5500 mm copper and 90% conductivity

NQFP−32

Figure 4. Example of NQFP−32 PCB Ground Plane

Figure 3. Example of SOIC−20 PCB Ground Plane

Layout (Preferred Layout at Top and Bottom)

http://onsemi.com

1 2 3 456 7 8...59

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与AMIS30621C6216G相关器件

型号	品牌	描述	获取价格	数据表
AMIS30621C6216RG	ONSEMI	Micro-Stepping Motor Driver	获取价格
AMIS30621C6217G	ONSEMI	Micro-Stepping Motor Driver	获取价格
AMIS30621C6217RG	ONSEMI	Micro-Stepping Motor Driver	获取价格
AMIS-30621-UGA	ONSEMI	IC STEPPER MOTOR CONTROLLER, 0.8 A, PDSO20, 300 INCH, PLASTIC, SOIC-20, Motion Control Ele	获取价格
AMIS-30621-UGA	AMI	Stepper Motor Controller, 0.8A, PDSO20, 300 INCH, PLASTIC, SOIC-20	获取价格
AMIS-30621-UNA	AMI	Stepper Motor Controller, 0.8A, 7 X 7 MM, NQFP-32	获取价格

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