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AMIS-30621-UGA PDF预览

AMIS-30621-UGA

更新时间: 2024-01-19 21:42:57
品牌 Logo 应用领域
AMI 电动机控制光电二极管
页数 文件大小 规格书
57页 1017K
描述
Stepper Motor Controller, 0.8A, PDSO20, 300 INCH, PLASTIC, SOIC-20

AMIS-30621-UGA 技术参数

生命周期:Transferred包装说明:300 INCH, PLASTIC, SOIC-20
Reach Compliance Code:unknown风险等级:5.64
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLERJESD-30 代码:R-PDSO-G20
长度:12.78 mm功能数量:1
端子数量:20最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流:0.8 A
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified座面最大高度:2.6416 mm
最大供电电压 (Vsup):29 V最小供电电压 (Vsup):8 V
标称供电电压 (Vsup):12 V表面贴装:YES
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:7.52 mmBase Number Matches:1

AMIS-30621-UGA 数据手册

 浏览型号AMIS-30621-UGA的Datasheet PDF文件第2页浏览型号AMIS-30621-UGA的Datasheet PDF文件第3页浏览型号AMIS-30621-UGA的Datasheet PDF文件第4页浏览型号AMIS-30621-UGA的Datasheet PDF文件第6页浏览型号AMIS-30621-UGA的Datasheet PDF文件第7页浏览型号AMIS-30621-UGA的Datasheet PDF文件第8页 
AMIS-30621 LIN Micro-stepping Motor Driver  
Data Sheet  
8.0 Package Thermal Resistance  
8.1 SOIC-20  
To lower the junction-to-ambient thermal resistance, it is recommended to connect the ground leads to a PCB ground plane layout as  
illustrated in Figure 3. The junction-to-case thermal resistance is depending on the copper area, copper thickness, PCB thickness, and  
number of copper layers. Calculating with a total area of 460 mm2, 35µm copper thickness, 1.6mm PCB thickness and 1layer, the  
thermal resistance is 28°C/W, leading to a junction-ambient thermal resistance of 63°C/W.  
PC20041128.1  
Figure 3: PCB Ground Plane Layout Condition  
8.2 NQFP-32  
The NQFP is designed to provide superior thermal performance. Using an exposed die pad on the bottom surface of the package is  
partly contributing to this. In order to take full advantage of this, the PCB must have features to conduct heat away from the package. A  
thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 4 the thermal resistance junction – to –  
ambient can be brought down to a level of 25°C/W.  
NQFP-32  
PC20041128.2  
Figure 4: PCB Ground Plane Layout Condition  
AMI Semiconductor – Sept. 2007, Rev 1.5  
5
www.amis.com  
 
 

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