Datasheet > AL8808

AL8808

更新时间： 2022-06-20 18:07:12

品牌	Logo	应用领域
美台 - DIODES		驱动器
页数	文件大小	规格书
20页	3275K
描述
COST EFFECTIVE LOW EMI 30V 1A BUCK LED DRIVER

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AL8808 数据手册

AL8808

Recommended Operating Conditions (@T_A= +25°C, unless otherwise specified.)

Symbol

V_IN

Parameter

Operating Input Voltage Relative to GND

Min

6.0

2.6

0.5

Max

Unit

Voltage High for PWM Dimming Relative to GND

Voltage Range for 20% to 100% DC Dimming Relative to GND

Voltage Low for PWM Dimming Relative to GND

Continuous Switch Current (Note 4)

5.5

2.5

0.4

V_CTRLH

V_CTRLDC

V_CTRLL

I_SW

Maximum Switching Frequency

MHz

°C

f_SW

Junction Temperature Range

-40

+125

T_J

Note:

4. Subject to ambient temperature, input voltage and switching frequency. See applications section for suggested derating.

Electrical Characteristics (@ T_A= +25°C, V_IN= 12V, CTRL pin floating; unless otherwise specified.)

Symbol

V_INSU

V_INSH

I_Q

Parameter

Internal Regulator Start Up Voltage

Internal Regulator Hysteresis Threshold

Quiescent Current

Conditions

Min

Typ

5.6

200

350

450

100

±20

Max

Unit

V_INrising

V_INfalling

µA

V_IN= 30V, output not switching

f_SW= 250kHz

Input Supply Current

I_S

Set Current Threshold Voltage

Set Threshold Hysteresis

105

V_TH

V_TH-H

I_SET

SET Pin Input Current

V_SET= V_IN-0.1

Open Circuit CTRL Pin Voltage

CTRL Pin Input Resistance

Internal Reference Voltage

On Resistance of SW MOSFET

Switch Leakage Current

V_CTRL

R_CTRL

V_REF

R_DS(on)

I_{SW_Lkg}

t_R

Referred to internal 5V regulator.

kΩ

2.5

0.35

ꢀ

I_SW= 0.35A

0.5

µA

V_IN= 30V, V_CTRL= 0.4V, V_SENSE= 0V

SW Rise Time

V_SENSE= 100 ±20mV, f_SW= 250kHz

V_SW= 0.1V to 12V to 0.1V, C_L= 15pF

SW Fall Time

t_F

Over-Temperature Shutdown

Over-Temperature Hysteresis

Thermal Resistance Junction-to-Ambient

Thermal Resistance Junction-to-Lead

Thermal Resistance Junction-to-Top

145

209

°C

T_OTP

T_OTP-Hyst

θ_JA

TSOT25 (Note 5)

°C/W

θ_JL

θ_JT

Notes:

5. Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to maximum area

bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

…Refer to Figure 42 for the device derating curve.

3 of 20

www.diodes.com

January 2013

AL8808

Document number: DS35648 Rev. 2 - 2

1 234 5 6 7...20

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