Datasheet > AFBR-5701ALZ

AFBR-5701ALZ

更新时间： 2024-01-10 04:34:00

品牌	Logo	应用领域
富士康 - FOXCONN		/
页数	文件大小	规格书
22页	338K
描述
Transceiver, 830nm Min, 860nm Max, 1250Mbps(Tx), 1250Mbps(Rx), LC Connector, ROHS COMPLIANT PACKAGE

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AFBR-5701ALZ 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8517.62.00.50	风险等级：	5.74
主体宽度：	13.4 mm	主体高度：	8.5 mm
主体长度或直径：	55.2 mm	内置特性：	AMPLIFIER
通信标准：	GR-468	连接类型：	LC CONNECTOR
数据速率（接收）：	1250 Mbps	数据速率（发送）：	1250 Mbps
发射极/检测器类型：	LASER, PIN PHOTODIODE	光纤设备类型：	TRANSCEIVER
光纤类型：	50/125, MMF	JESD-609代码：	e4
最高工作温度：	85 °C	最低工作温度：	-40 °C
最大工作波长：	860 nm	最小工作波长：	830 nm
标称工作波长：	850 nm	标称光功率输出：	0.223 mW
最小回损：	-12 dB	灵敏度：	-21 dBm
子类别：	Fiber Optic Transceivers	最大供电电压：	3.465 V
最小供电电压：	3.135 V	标称供电电压：	3.3 V
端子面层：	Gold (Au)	Base Number Matches：	1

AFBR-5701ALZ 数据手册

OPTICAL INTERFACE

LIGHT FROM FIBER

ELECTRICAL INTERFACE

RECEIVER

RD+ (RECEIVE DATA)

RD—(RECEIVE DATA)

Rx LOSS OF SIGNAL

AMPLIFICATION

& QUANTIZATION

PHOTO-DETECTOR

MOD-DEF2 (SDA)

CONTROLLER & MEMORY

MOD-DEF1 (SCL)

MOD-DEF0

TRANSMITTER

TX_DISABLE

LASER

DRIVER &

SAFETY

TD+ (TRANSMIT DATA)

TD—(TRANSMIT DATA)

TX_FAULT

LIGHT TO FIBER

VCSEL

CIRCUITRY

Figure 1. SFP Block Diagram

Overview

3 2 1

ENGAGEMENT

SEQUENCE

V_EE

TD–

TD+

V_EE

V_CC

V_EET

The AFBR-570xZ family of optical transceivers are

compliant with the specifications set forth in the

IEEE802.3 (1000BASE-SX), Fibre Channel (100-M5-SN-I,

100-M6-SN-I), and the Small Form-Factor Pluggable

(SFP) Multi-Source Agreement (MSA). This family of

transceivers is qualified in accordance with Telcordia

GR-468-CORE. Its primary application is servicing Gigabit

Ethernet and Fibre Channel links between optical

networking equipment.

TX FAULT

TX DISABLE

MOD-DEF(2)

MOD-DEF(1)

MOD-DEF(0)

RATE SELECT

LOS

_CCR

_EER

The AFBR-570xZ offers maximum flexibility to designers,

manufacturers, and operators of Gigabit Ethernet

networking equipment. A pluggable architecture allows the

module to be installed into MSA standard SFP ports at any

time – even with the host equipment operating and online.

This facilitates the rapid configuration of equipment to

precisely the user’s needs – reducing inventory costs and

network downtime. Compared with traditional transceivers,

the size of the Small Form Factor package enables higher

port densities.

RD+

RD–

V_EE

TOP OF BOARD

BOTTOM OF BOARD

(AS VIEWED THROUGH TOP OF BOARD)

Figure 2. Pin description of the SFP electrical interface.

Module Diagrams

Figure 1 illustrates the major functional components of the

AFBR-570xZ. The external configuration of the module is

depicted in Figure 7. Figure 8 depicts the panel and host

board footprints.

123 4 5 6 7...22

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